Microelectronic device with integrated energy source

ABSTRACT

An apparatus including an electronic device having a plurality of substantially collocated components, the plurality of components including an antenna, an energy supply and an integrated circuit chip. The integrated circuit chip is electrically coupled to the antenna and the energy supply. A material substantially encloses the electronic device.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation U.S. patent application Ser. No.12/467,703, filed May 18, 2009, entitled “MICROELECTRONIC DEVICE WITHINTEGRATED ENERGY SOURCE,” which was a continuation of U.S. patentapplication Ser. No. 11/259,567, filed Oct. 25, 2005, entitled“MICROELECTRONIC DEVICE WITH INTEGRATED ENERGY SOURCE,” now U.S. Pat.No. 7,557,433; which claimed priority to and the benefit of the earlierfiling date of U.S. Provisional Patent Application No. 60/621,900, filedOct. 25, 2004, entitled “Microelectronic device with integrated energysource,” the entirety of which is hereby incorporated by referenceherein. This application is also a continuation-in-part of U.S. patentapplication Ser. No. 10/685,825, filed Oct. 13, 2003, entitled“Integrated circuit package with laminated power cell having coplanarelectrode,” now U.S. Pat. No. 7,230,321.

The entire disclosure of each of the above applications/patents ishereby incorporated herein by reference.

BACKGROUND OF THE DISCLOSURE

The continued physical feature size reduction and scaling ofself-sustaining, low power consuming, and other microelectronic devicesis currently limited in enclosure packaging reductions by the inclusionof a dedicated energy source for operation. For example, many currentand future applications require self-sustaining integrated circuitpackages and other microelectronic device packages that are able toperform specific functions and operate as independent elements within asensory, communications, and/or computational network or domain. Suchmicroelectronic device types may be or include single or mixed types ofdevice technologies based on analog, digital, organic, molecular,nano-electronic, micro-electro-mechanical (MEMS), andnano-electro-mechanical (NEMS), among other device type technologies.Existing integration methods which include processes to assemblemicroelectronic devices with dedicated energy sources into a singleproduct often require excessive semiconductor substrate real estateand/or complex interconnection processes to produce a self-sustainableand operational microelectronic product.

Microelectronic devices in current applications may be utilized assensors and/or actuators, such as applications in the automotive,telecommunication, computing, consumer, medical, aerospace, andagriculture industries, among others. Such devices may be utilized tosense environmental and/or material characteristics, such astemperature, pressure, voltage, vibration and composition, among others.Such devices may also be employed to trigger actuators for any number ofother electrical or mechanical devices. However, while data detected bysuch devices may be wirelessly transmitted to or received from aperipheral unit through existing wireless protocols (e.g., IEEE 802.11,BLUETOOTH, WiFi, WiMAX, software defined radio, and ultra wide band(UWB), among others) the devices must still be tethered or “plugged-in”to a power source to enable the sensing and wireless processing events.This fact can impose significant limitations on the implementation ofsensors in many applications.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isemphasized that, in accordance with the standard practice in theindustry, various features are not drawn to scale. In fact, thedimensions of the various features may be arbitrarily increased orreduced for clarity of discussion.

FIG. 1A is a sectional view of at least a portion of an embodiment ofapparatus in an intermediate stage of manufacture according to aspectsof the present disclosure.

FIG. 1B is a sectional view of the apparatus shown in FIG. 1A in asubsequent stage of manufacture.

FIG. 1C is a sectional view of the apparatus shown in FIG. 1B in asubsequent stage of manufacture.

FIG. 2A is a sectional view of at least a portion of an embodiment ofapparatus in an intermediate stage of manufacture according to aspectsof the present disclosure.

FIG. 2B is a sectional view of the apparatus shown in FIG. 2A in asubsequent stage of manufacture.

FIG. 2C is a sectional view of the apparatus shown in FIG. 2B in asubsequent stage of manufacture.

FIG. 2D is a sectional view of the apparatus shown in FIG. 2C in asubsequent stage of manufacture.

FIG. 3 is a sectional view of at least a portion of an embodiment ofapparatus according to aspects of the present disclosure.

FIG. 4A is an exploded perspective view of at least a portion of anembodiment of apparatus according to aspects of the present disclosure.

FIG. 4B is another view of the apparatus shown in FIG. 4A.

FIG. 4C is a sectional view of the apparatus shown in FIG. 4A.

FIG. 5A is a top view of at least a portion of an embodiment ofapparatus according to aspects of the present disclosure.

FIG. 5B is a left side view of the apparatus shown in FIG. 5A.

FIG. 5C is a bottom view of the apparatus shown in FIG. 5A.

FIG. 5D is a right side view of the apparatus shown in FIG. 5A.

FIG. 5E is an exploded perspective view of the apparatus shown in FIG.5A demonstrating a subsequent stage of manufacture according to aspectsof the present disclosure.

FIG. 5F is an exploded perspective view of the apparatus shown in FIG.5E demonstrating a subsequent stage of manufacture according to aspectsof the present disclosure.

FIG. 5G is a bottom view of an at least a portion of one embodiment ofan apparatus according to aspects of the present disclosure, which maybe a portion of the apparatus shown in FIGS. 5A-5F.

FIG. 5H is another perspective view of the apparatus shown in FIG. 5E.

FIG. 6A is a schematic view of at least a portion of an embodiment ofapparatus according to aspects of the present disclosure.

FIG. 6B is a schematic view of at least a portion of another embodimentof the apparatus shown in FIG. 6A.

FIG. 7 is a schematic view of at least a portion of an embodiment ofapparatus according to aspects of the present disclosure.

FIG. 8A is a schematic view of another embodiment of the apparatus shownin FIG. 7.

FIG. 8B is a schematic view of another embodiment of the apparatus shownin FIG. 7.

FIG. 8C is a schematic view of another embodiment of the apparatus shownin FIG. 7.

FIG. 8D is a schematic view of another embodiment of the apparatus shownin FIG. 7.

FIG. 8E is a schematic view of another embodiment of the apparatus shownin FIG. 7.

FIG. 9A is a schematic view of a system and apparatus according toaspects of the present disclosure.

FIG. 9B is a schematic view an embodiment of apparatus shown in FIG. 9A.

FIG. 9C is a schematic view an embodiment of apparatus shown in FIG. 9A.

FIG. 9D is a schematic view an embodiment of apparatus shown in FIG. 9A.

FIG. 9E is a flow-chart diagram of at least a portion of an embodimentof logic structure according to aspects of the present disclosure.

FIG. 9F is a flow-chart diagram of at least a portion of an embodimentof logic structure according to aspects of the present disclosure.

FIG. 9G is a flow-chart diagram of at least a portion of an embodimentof logic structure according to aspects of the present disclosure.

FIG. 10 is a schematic view of a system and apparatus according toaspects of the present disclosure.

FIG. 11 is a schematic view of a system and apparatus according toaspects of the present disclosure.

FIG. 12 is a schematic view of a system and apparatus according toaspects of the present disclosure.

DETAILED DESCRIPTION

It is understood that the following disclosure provides many differentembodiments, or examples, for implementing different features, apparatusand methods according to aspects disclosed herein. Specific examples aredescribed below to simplify the present disclosure. These are, ofcourse, merely examples and are in no way intended to be limiting. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.Moreover, the formation of a first feature over or on a second featurein the description that follows may include embodiments in which thefirst and second features are formed in direct contact, and may alsoinclude embodiments in which additional features may be formedinterposing the first and second features, such that the first andsecond features may not be in direct contact.

Exemplary processes which demonstrate the high complexity ofinterconnecting the individual operations of a multifunction integratedcircuit and an energy source (whether the energy source is an energygenerating device and/or an energy storage device) become readilyapparent when examining the mechanical dimensions of micro- ornano-scale devices designed for substantially autonomous operation.Historically, integrated circuit feature dimensions (e.g., gate widths)of microelectronic, MEMS and other micro-scale devices have reduced inphysical size from about 2.0 μm to today's envisioned 0.35 μm orsmaller. For currently envisioned nanoelectronic, NEMS and othernano-scale devices, feature dimensions are predicted to be as small asabout 2 nm, if not smaller.

However, for the purposes of the present disclosure, one mayadditionally or alternatively consider microelectronic and othermicro-scale devices to have feature dimensions (other than or inaddition to thickness) having an order of magnitude of about 1000 μm orsmaller, whereas nanoelectronic and other nano-scale devices havesimilar feature dimensions having an order of magnitude of about 1000 nmor smaller. For example, the lateral dimensions of a microelectronicdevice feature may be about 500 μm, whereas the lateral dimensions of ananoelectronic device feature may be about 500 nm.

Nonetheless, many aspects of the present disclosure are not limited tothe exemplary definitions of scale described above. Moreover, aspects ofthe present disclosure may be applicable or readily adaptable todimensional scales other than the scale employed in discussing suchaspects. For example, aspects of micro-scale devices described orotherwise within the scope of the present disclosure may be applicableor readily adaptable to nano-scale devices and devices of otherdimensional scale, and aspects of nano-scale devices described orotherwise within the scope of the present disclosure may be applicableor readily adaptable to micro-scale devices and devices of otherdimensional scale.

The present disclosure introduces exemplary embodiments of solid stateenergy sources for providing operating power to integrated circuitdevices. However, aspects of the present disclosure are applicableand/or readily adaptable to apparatus including energy sourcesintegrated with other types of microelectronic devices. Such otherdevices may be or include, without limitation, micro-electro-mechanical(MEMS) devices, nano-electro-mechanical (NEMS) devices, nanotechnologydevices, and/or other forms of silicon-based and other semiconductiveelectronic devices. These other embodiments, although not necessarilyillustrated in the present disclosure, are well within the intent,spirit and scope of the present disclosure.

The existence of an integrated power source within an enclosed package,such as with a sensor, an integrated circuit and/or a wirelesstransmitter/receiver, may allow for vast improvements in the deploymentof sensor-based microelectronic devices, and possibly the reconnaissanceof information acquisition and communications methods thereof. Inembodiments within the scope of the present disclosure, such a wirelessmicroelectronic device may be employed in a mobile application, such asto monitor movements of cattle and/or other domesticated or feralanimals.

For example, embodiments within the scope of the present disclosure mayprovide means for preventing cattle from crossing fences or otherboundaries, or from straying into areas where they are not intended.Such means may include a microelectronic device attached to an animal,wherein the device may include sensors and possibly utilize a geographicdatabase and/or communications protocol to wirelessly transmit theidentity and/or location of the animal to a static “fence-post” unit,which may relay proximity values back to the device. At fixed (thoughpossibly arbitrary) proximity intervals, the device may wirelesslyactuate a mechanism for diverting the motion of the animal beyond apredetermined boundary. However, such a device might not be feasible ina rural setting without utilizing an integrated power supply andwireless transmission of data.

According to aspects of another embodiment of the present disclosure, asimilar microelectronic device may be utilized in a static orquasi-mobile environment, such as within a hospital room. For example,electro-cardio-gram (ECG) devices typically employ electrical sensors tomonitor heart rates and waveforms. Microelectronic devices can be usedto sense these cardiovascular oscillations and wirelessly transmit themback to a peripheral unit for aggregation and processing. The peripheralunit may transmit a time-stamp signal to synchronize a plurality ofwireless devices that are collectively utilized to constructively andcohesively sense the heart waveform. These devices, having integratedpower sources, need not be linked through a plurality of wires to apower unit, which may greatly reduce the set-up time necessary to wire apatient prior to the performing the ECG procedure, and may also reducethe unpleasant psychological effect of having a plurality of wiresconnected to a patient.

Referring to FIG. 1A, illustrated is a sectional view of at least aportion of one embodiment of an apparatus 100 in an intermediate stageof manufacture according to aspects of the present disclosure. Theapparatus 100 includes an electrode 110 coupled to a frame 120. Theelectrode 110 may comprise aluminum, copper, gold, and/or otherelectrically conductive materials, and may be secured to the frame 120by adhesive, bonding, brazing, clamps and/or other mechanical fasteners,and/or other means. The electrode 110 may have a thickness rangingbetween about 2 μm and about 20 μm. However, other thicknesses are alsowithin the scope of the present disclosure. For example, in an exemplarynano-scale embodiment, the thickness may range between about 10 nm andabout 100 nm.

The frame 120 includes an opening 125 configured to received an energydevice according to aspects of the present disclosure. The perimeter ofthe opening 125 may substantially or approximately correspond to aperimeter of a microelectronic device to be coupled to and at leastpartially powered by the energy device. The perimeter of the opening 125may have a substantially square, rectangular, circular, elliptical, orother regular or irregular geometric shape having lateral dimensionsranging between about 7 nm and about 50 mm. For example, the lateraldimensions of the opening 125 may range between about 7 mm and about 9mm in one implementation, while in another implementation the lateraldimensions of the opening 125 may range between about 1 mm and about 9mm. In one implementation, the opening 125 has a substantially squareshape having sides of about 1 mm.

The frame 120 may be formed by forming the opening 125 in a sheet orplate of frame material, which may comprise one or more ceramics,plastics, and/or other electrically insulating materials. Examples ofthe frame material include ceramic, fused silica, and/or siliconcarbide, although other materials are also within the scope of thepresent disclosure. The frame 120 may have a thickness ranging betweenabout 0.3 mm and about 0.8 mm, although other thicknesses are alsowithin the scope of the present disclosure. For example, in an exemplarynano-scale embodiment, the thickness may range between about 1 nm andabout 20 nm. The opening 125 may be one of a plurality of possiblysimilar openings formed in the frame material, and may be formed in theframe material by micromachining, laser machining, casting, molding,stamping or cutting, and/or or other processes. The frame 120 may alsocomprise more than one layer of materials, including electricallyconductive and insulating materials, wherein the multiple layers may bejoined in a vertical fashion by adhesive, bonding, welding, and/or otherprocesses.

The electrode 110 may substantially cover an entire surface of the frame120, including the opening formed by the opening 125. However, inanother embodiment, the perimeter of the electrode 110 may moresubstantially correspond to the perimeter of the opening 125. The frame120 may also include a shallow recess or other indentation configured toreceive the electrode 110. For example, the electrode 110 may be coupledto the frame 120 by press-fitting or otherwise forming an interferenceor friction engagement between the perimeter of the electrode 110 andthe perimeter of the shallow indentation in the frame 120.

Referring to FIG. 1B, illustrated is a sectional view of the apparatus100 shown in FIG. 1A in which an energy device 130 has been formed orotherwise positioned in the opening 125. An exemplary configuration ofthe energy stack 130 follows, although other configurations of theenergy device 130 are also within the scope of the present disclosure.

In the illustrated embodiment, the energy device 130 comprises aseparator layer 130 b interposing electrode layers 130 a, 130 c. Each ofthe energy device layers 130 a-c may individually comprise more than onelayer, possibly of more than one material. The separator layer 130 b maycomprise manganese, titanium, vanadium, other solid electrolytematerials, and/or other materials. In one implementation, the separatorlayer 130 b comprises lithium perchlorate (LiClO₄) mixed withpolyvinylidene (LiClO₄-PVDF). The separator layer 130 b may also oralternatively comprise a lithium salt cross-linked with apolyethyleneoxide.

The electrode layers 130 a, 130 c form an anode and a cathode of theenergy device 130. That is, the electrode layer 130 a may be an anode ofthe energy device 130, and the electrode layer 130 c may be a cathode ofthe energy device 130, or the electrode layer 130 a may be a cathode ofthe energy device 130, and the electrode layer 130 c may be an anode ofthe energy device 130. In either case, the cathode may comprise dioxide,disulfide, pentoxide, and/or other materials. The cathode may also beimpregnated with p-type or n-type elemental and/or nano-technologyimpurities, such as to enhance cathode charging performance andconductivity, possibly depending on the doping scheme employed in thefabrication of the microelectronic device to be packaged with the energydevice 130.

The anode may be or comprise a metal alloy film or foil that may beimpregnated with lithium or lithium alloy impurities. The anode may alsobe impregnated with p-type or n-type elemental and/or nano-technologyimpurities to enhance anode charging performance and conductivity,possibly depending on the doping scheme employed in the fabrication ofthe microelectronic device to be packaged with the energy device 130. Inone embodiment, the cathode may be doped with a first impurity type(e.g., n-type) while the anode may be doped with a second, oppositeimpurity type (e.g., p-type). Of course, the present disclosure is in noway limited to any particular doping scheme of the energy device 130 orthe microelectronic device to be packaged with the energy device 130.

The energy device 130 may employ a lithium-manganese-dioxide chemistry,including those which are readily available commercially and/orotherwise understood by those skilled in the art. Another example of theenergy device 130 chemistry may be lithium-titanium-disulfide (Li—TiSO₂)or lithium-vanadium-pentoxide (Li—V₂O₅). Also, as discussed above, thecathode and/or anode may be doped with impurities, such as thosetypically employed in a semiconductor doping scheme. In that regard, theorder in which the cathode, anode and separator 130 b are fabricatedwithin the frame 120 may depend on the fabrication processes of themicroelectronic device to be packaged with the energy device 130. Forexample, the cathode may be associated with (or fabricated concurrentlywith) an n-type semiconductor device substrate or layer and the anodemay be similarly associated with a p-type semiconductor substrate orlayer. The energy device 130 may have a thickness ranging between about200 μm and about 1000 μm, although other thicknesses are also within thescope of the present disclosure. For example, the thickness of theenergy device 130 may range between about 300 μm and about 750 μm, suchas about 400 μm. Each of the individual layers forming the energy devicelayers 130 a-c may have a thickness ranging between about 25 μm andabout 100 μm. In an exemplary nano-scale implementation, the thicknessof the energy device 130 may range between about 1 nm and about 20 nm,such as where the thickness of each of the energy device layers 130 a-cis substantially less than about 10 nm.

The anode may be formed by slicing a rolled lithium foil (possiblycomprising battery grade, 99.8% pure lithium) into ingots toapproximately 40 μm in length. The anode may also be alloyed with suchmetals as aluminum, manganese, and/or copper.

A polymer matrix used by both the separator and cathode material (e.g.,layers 130 b and 130 a, respectively) may be formed by emulsifyingpolymer resin pellets, possibly in combination with a plasticizer. Thepolymer matrix may comprise polyacrylonitrile (PAN), polyvinylidenfluoride (PVdF) and/or polyvinyl sulfone (PVS), and the plasticizer maycomprise dibutyl phthalate (DBP). Additionally, the polymer matrix mayalso comprise one or more polymer additives, possibly includingnano-technology derived additives, which may be formulated to enhance aspecific operational or performance characteristic. The polymer matrixand plasticizer may be emulsified in acetonitrile at about 60° C. in areactor vessel equipped with a nitrogen inlet, a reflux condenser, and astirring mechanism. The resulting viscous solution may then be cast intoa polymer substrate to yield a film thickness ranging between about 30μm and about 100 μm. The cast polymer membrane film may then be dried,such as in an oven, possibly at a temperature of about 80° C., which mayat least partially remove the acetonitrile casting agent. After beingallowed to dry, the originally highly-viscous membrane may be atranslucent, flexible polymer membrane that also contains ahigh-temperature plasticized structure for rigidity.

In one implementation, electrolyte components possibly consisting ofEthylenecarbonate-EC, Propylyenecarbonate (PC), and Lithium Perchlorate(LiClO₄), mixed in an exemplary ratio of approximately 52/41/7 byweight, respectively, may be used in the preparation of the polymerelectrolyte film as described in the above-mentioned emulsificationprocess. For example, the electrolyte solution may be heated, possiblyto a temperature of about 60° C., and the polymer film may be placedinto the heated electrolyte solution, possibly for a period of up to 8hours, to allow the electrolyte salt to link to the polymer structure.When the polymer film is removed from the electrolyte solution, it maybe cooled to room temperature, which may allow additional electrolyteand polymer cross linking. The resulting solid state electrolyteseparator membrane may then be cut to a desirable width and length tocomplete the separator layer 130 b.

A similar process may be employed to form the cathode. However, such apolymer film employed to form the cathode may have a thickness rangingbetween about 300 μm and about 750 μm. Possibly employing the same typeof reactor agent vessel with stiffing mechanism, the polymer emulsionwith plasticizer agent may be mixed with an electrochemical grade ofLiMn_(x)O_(y) spinel (FMC-Lithium) and a Super-P carbon such as VulcanXC-72 (Cabot). For example, a mixture of polyethylene oxide containinghigh-temperature plasticizers, LiMnO₂ spinel (FMC-Lithium) and Super-Pcarbon (Vulcan-XC-72 Cabot) may be used in a ratio of approximately55/42/3 by weight, respectively. The resulting polymer film may then becut to a desirable width and length to form the cathode.

The energy device layers 130 a-c may be formed or otherwise positionedin the frame 130 by pressing the individual or stacked layers into theopening 125. The energy device layers 130 a-c may be cut-to-size priorto positioning in the opening 125, or may be trimmed after, or as aresult of, their installation into the opening. In one embodiment, theenergy device layers 130 a-c may be individually or collectivelycompressed during or after their installation into the opening 125. Forexample, the energy device layers 130 a-c may be subjected to acompression force ranging between about 10 psi (69 kPa) and about 200psi (1379 kPa). In one embodiment, the compression force ranges betweenabout 30 psi (207 kPa) and about 50 psi (349 kPa), such as about 40 psi(279 kPa). The energy device layers 130 a-c may be compressed until adesired thickness is achieved. Alternatively, or additionally, theenergy device layers 130 a-c may be compressed until a desired outputcurrent is achieved from a given voltage.

Referring to FIG. 1C, illustrated is a sectional view of the apparatus100 shown in FIG. 1B in which an additional electrode 140 has beencoupled to the frame 120 and/or the energy device 130. Consequently, theenergy device 130 may be sandwiched between and possibly directlycontact each of the electrodes 110, 140. The electrode 140 may besubstantially the same as the electrode 110, and may be secured to theframe 120 and/or the energy device 130 in substantially the same manner,or via one of the other securing means described above regarding theattachment of the electrode 110 to the frame 120. The compressionprocess described above may be performed after the electrode 140 hasbeen secured to the frame 120 and/or the energy device 130, either inaddition to or in the alternative to performing the compression processafter the energy device 130 is formed in the frame 120.

The above-described manufacturing process for fabricating the apparatus100 may also include verifying a maximum relative flatness and/orparallelism of the electrodes 110, 140. For example, the compressionprocess described above may be performed sufficiently to achieve maximumflatness and/or minimum variation in parallelism of the electrodes 110,140 of about 5 μm or less.

Referring to FIG. 2A, illustrated is a sectional view of at least aportion of an embodiment of the apparatus 100 shown in FIG. 1A, hereindesignated by numeral reference 100A. The apparatus 100A issubstantially similar to the apparatus 100 shown in FIG. 1A, althoughthe apparatus 100A includes multiple instances of the frame 120, theenergy device 130, and the electrodes 110, 140.

In the manufacturing stage illustrated in FIG. 2A, a sheet or plate offrame material 120A having openings 125 formed therein is secured to anelectrode sheet 110A The frame material 120A and electrode sheet 110Amay each be substantially similar in composition and manufacture to theframe 120 and electrode 110, respectively, shown in FIGS. 1A-1C. Theelectrode sheet 110A and the frame material 120A may also be secured toone another in a manner similar to the attachment of the frame 120 andthe electrode 110 discussed above. The electrode sheet 110A may comprisea single continuous sheet or more than one sheet each corresponding toone or more of the openings 125.

Referring to FIG. 2B, illustrated is a sectional view of the apparatus100A shown in FIG. 2A in which an energy device 130 has been formed ineach of the openings 125 in the frame material 120A. Each of the energydevices 130 shown in FIG. 2B may be substantially similar to the energydevice 130 shown in FIGS. 1B, 1C. Once formed in the openings 125, theenergy devices 130 may be individually or collectively compressed, suchas by the compression processes described above.

The sequence by which the energy devices 130 are assembled in theopenings 125 is not limited within the scope of the present disclosure.For example, a first energy device layer 130 a may be formed in acorresponding opening 125, a second energy device layer 130 b may thenbe formed in the opening 125, and a third energy device layer 130 c maybe formed in the opening 125, then this process may be repeated for eachremaining opening 125, individually. Alternatively, the first energydevice layer 130 a may be formed in each of the openings 125, then thesecond energy device layer 130 b may be formed in each of the openings125, and then the third energy device layer 130 c maybe formed in eachof the openings 125. In such an embodiment, a sheet of first energydevice layer material may be dispensed as a liquid into the frame, or asa solid sheet placed over the frame material 120A and punched, pressedor otherwise positioned in each of the openings 125, such as by a die orroller, and a similar process may be repeated for each of the remainingenergy device layers.

Each of the layers forming an energy device 130 (e.g., layers 130 a-c)may alternatively be pre-assembled to one another to form an energydevice layer stack. Thereafter, the layer stack may be formed in each ofthe openings 125 one at a time, or the layer stack may be formed in eachof the openings 125 substantially simultaneously. For example, a rolleror die press having bosses substantially corresponding to the shape andposition of the openings 125 may be employed to position portions of thelayer stack into corresponding openings 125.

Referring to FIG. 2C, illustrated is a sectional view of the apparatus100A shown in FIG. 2B in which an additional electrode sheet 140A hasbeen secured to the frame material 120A and/or each of the energydevices 130. The electrode sheet 140A may be substantially similar incomposition and manufacture to the electrode 110 shown in FIGS. 1A-1C.The electrode sheet 140A may also be secured to the frame material 120Aand/or the energy devices 130 in a manner similar to the attachment ofthe electrode 140 to the frame 120 discussed above. The electrode sheet140A may comprise one continuous sheet or more than one sheet eachcorresponding to one or more of the openings 125. The compressionprocess described above may also be performed after the electrode sheet140A has been secured to the frame material 120A and/or the energydevices 130, either in addition to or in the alternative to performingthe compression process after the energy devices 130 are formed in theopenings 125.

At the manufacturing stage shown in FIG. 2C, the apparatus 100A may besubstantially configured to provide energy to one or more devices to bepackaged with the apparatus 100A. Portions of the electrode sheets 110A,140A may be removed to separate one or more of the energy devices fromone another. For example, two or more adjacent energy devices 130 mayremain interconnected by portions of one or both of the electrode sheets110A, 140A and/or frame material 120, such as where the energyrequirements for a particular device packaged therewith are greater thanthe capacity of each individual energy device 130. Such an embodimentmay be advantageous when a standard energy device 130 may be desired.However, in such embodiments where adjacent energy devices areinterconnected by one or both of the electrode sheets 110A, 140A and/orframe material 120, the layers employed as anode and cathode layers insome of the energy devices 130 may need to be reversed.

Referring to FIG. 2D, illustrated is a sectional view of the apparatus200 shown in FIG. 2C in which individual apparatus 100B have been formedfrom the apparatus 100A by dicing or otherwise removing portions of theelectrode sheets 110A, 140A and/or frame material 120A. Each of theapparatus 100B may be substantially similar to the apparatus 100 shownin FIG. 1C. Two or more of the apparatus 100B may also be stacked in asingle package, such as to provide additional energy capacity. However,in such embodiments, one or both of the electrode sheets 110A, 140Ainterposing two vertically stacked energy devices 130 may be removed.

Referring to FIG. 3, illustrated is a sectional view of at least aportion of one embodiment of an apparatus 200A according to aspects ofthe present disclosure. The apparatus 200A includes an energy cell 210that may be substantially similar to the apparatus 100 shown in FIG. 1C,one of the apparatus 100B shown in FIG. 2D, and/or one of the energydevices 130 shown in FIG. 1B, 1C, or 2B-2D. The apparatus 200A alsoincludes a device 220 to be at least partially powered by the energycell 210. An interface layer 230 may comprise or at least partiallyprovide one or more interfaces between the energy cell 210 and thedevice 220.

Although not illustrated, aspects of the present disclosure are alsoapplicable and/or readily adaptable to other embodiments of theapparatus 200A which may include more than one energy cell 210, morethan one device 220, and/or more than one interface layer 230. In suchembodiments, the multiple energy cells 210 may or may not besubstantially identical, the multiple devices 220 may or may not besubstantially identical, and the multiple interface layers 230 may ormay not be substantially identical.

The device 220 may be or comprise one or more integrated circuitdevices, micro-electromechanical (MEMS) devices, nano-electromechanical(NEMS) and other nano-scale devices, organic electronic devices, othermicroelectronic devices, sensor devices, RFID devices, and/or a varietyof combinations thereof. The device 220 may additionally oralternatively comprise a plurality of transistors, capacitors,inductors, analog signal processing devices, memory devices, logicdevices, and/or other microelectronic devices interconnected by, forexample, a plurality of electrically conductive vias, landing pads,and/or other forms of electrically conductive interconnects. Several ofsuch devices and interconnects are collectively designated by referencenumeral 222 in FIG. 3.

Although not limited as with in the scope of the present disclosure, thedevice 220 may be any device having electrically conductive contacts 225configured for connection with an energy source. Such devices may beformed on and/or in a substrate 227 substantially comprising silicon, ora variety of other semiconductor materials, and/or a variety of othersubstrate suitable materials. In one embodiment, such a device havingsuch a substrate 227 may include electrically conductive contacts, viasor other electrically conductive members 225 extending at leastpartially into or through the substrate 227 to a bottom or other surfacefor interconnection with the energy cell 210 via the interface layer230. The conductive members 225 may electrically couple the energy cell210, at least indirectly, with one or more of the individual deviceswhich compose the device 220. The device 220 may also or alternativelyinclude or otherwise be electrically interconnected by wire bonds to theenergy cell 210. The device 220 may also or alternatively beelectrically connected to the energy cell 210 via the interface layer230 by flip-chip mounting or other processes employing stud bumps,solder balls, and/or electrically conductive epoxy or other adhesives.

The interface layer 230 may comprise one or more layers of variouselectrically conductive and/or electrically insulating materials. Forexample, in the embodiment illustrated in FIG. 3A, the interface layer230 comprises a number of electrically conductive members 235 configuredto interconnect contacts 225 of the device 220 with the energy cell 210.The electrically conductive members 235 may comprise aluminum, copper,gold, tungsten, conductive epoxy and other electrically conductiveadhesives, solder, and/or other materials. Gaps 237 between theconductive members 235 may substantially comprise air, inert gases(e.g., argon), a vacuum, and/or dielectric materials such as silicondioxide, fluorinated silicate glass (FSG), SILK (a product of DowChemical), or Black Diamond (a product of Applied Materials).

The interface layer 230 may also be or at least partially comprise aflag, paddle, central support member or other portion of a lead frameemployed to interconnect power and/or data contacts of the device 220with surrounding circuitry. However, such lead frame portion mayalternatively be positioned elsewhere besides interposing the energycell 210 and the device 220. For example, the energy cell 210 mayinterpose and possibly contact both the lead frame and the device 220,or the device 220 may interpose and possibly contact both the lead frameand the energy cell 210. In such embodiments, the contact between theenergy cell 210, the device 220 and/or the lead frame may be through oneor more intermediary layers, such as may be employed to improveadhesion, electrical conductivity and/or electrical isolation betweenthe “contacting” components.

The apparatus 200A may also include a manufacturing process handling ortransport substrate or other structure coupled to the energy cell 210(hereafter referred to as the handle 240), such as in the illustratedexample. Among other possible purposes, the handle 240 may assist in thehandling of the apparatus 200A during and/or after manufacturing.However, the apparatus 200A may not include the handle 240. Nonetheless,when the handle 240 is employed, it may be removed and possiblydiscarded during or after manufacturing. When employed, the handle 240may also be positioned relative to the other features of the apparatus200A in locations other than as shown in FIG. 3A. For example, thehandle 240 may be coupled to the device 220 rather than to the energycell 210. The handle 240 may also be employed during the manufactureand/or assembly of the feature to which it is coupled. For example, thehandle 240 may be integral to or otherwise coupled to the energy cell210 or the device 220 during the manufacture and/or assembly thereof.

The apparatus 200A may also include a sacrificial or release layer 245interposing the handle 240 and the remainder of the apparatus 200A. Thesacrificial layer 245 may comprise silicon dioxide, polysilicon, and/orother materials easily removable by a diluted hydrofluoric acid etchand/or other conventional or future-developed sacrificial layer removalprocesses. The sacrificial layer 245 may also or alternatively comprisean adhesive which may permanently or temporarily bond the handle 240 tothe energy cell 210 or other portion of the apparatus 200A. Clampsand/or other mechanical fasteners may be employed in addition to or inthe alternative to the sacrificial layer 245.

The apparatus 200A may also include or be encapsulated in one or moreinsulating layers formed around a substantial portion of the apparatus200A, such as to protect the apparatus 200A from potentially hazardousmechanical and environmental elements which may cause damage ordestruction. Such encapsulating or insulating layer(s) may comprisepolyphenolene sulfide and/or a variety of another non-conductiveencapsulant materials

Referring to FIG. 4A, illustrated is an exploded perspective view of atleast a portion of an embodiment of an apparatus 300 according toaspects of the present disclosure. The portion of the apparatus 300shown in FIG. 4A includes an energy cell 310 having an energy device 130formed or otherwise positioned in a frame 120, as well as electrodes110, 140. The energy cell 310 may be substantially similar to theapparatus 100 shown in FIG. 1C and/or the apparatus 100B shown in FIG.2D. For the sake of clarity, a portion of the energy device 130 and theframe 120 have been removed and the electrodes 110, 140 are shown in adisassembled configuration.

The frame 120 may include an electrically conductive via or otherconductive member 320 extending through the frame 120. The perimeter ofthe electrode 140 may also include a scallop, recess, indentation, orotherwise defined profile 325 configured such that the electrode 140does not electrically contact the conductive member 320 when theelectrode 140 is coupled to the frame 120, such as in the assembledconfiguration of the energy cell 310 shown in the perspective view inFIG. 4B.

Referring to FIG. 4C, illustrated is a sectional view of the apparatus300 shown in FIG. 4A in which the energy cell 310 and a device 220 to bepackaged with the energy cell 310 have been coupled via an interposingmember 330. The device 220 may be substantially similar to the device220 discussed above with reference to FIG. 3.

The interposing member 330 may be or comprise at least a portion of apaddle, flag, and/or other portion of a lead frame. In one embodiment,such a lead frame may be a conventional or future-developed lead frameassembly having an industry-standard geometry and composition. The leadframe assembly may include a paddle, flag, or other central supportmember and a plurality of formable, flexible metal leads that extendradially around the periphery of the central support member to aplurality of “J” style leads or other end use, packaging styleappropriate pin connectors. In one embodiment, the lead frame assemblymay include 28 pairs of leads and connectors, such as the Olin BrassC194 distributed by A.J. Oster Company of Warwick, R.I. The centralsupport member may also include a conductive coating on one or bothmajor surfaces thereof to increase their electrical conductivity.Although not limited by the scope of the present disclosure, such aconductive coating may be or comprise a graphite based coating having athickness of about 25 μm, such as Electrodag® EB-012 distributed by theAcheson Colloids Company of Port Huron, Mich. The conductive coating maybe applied by lamination or conventional or future-developed thin-filmdeposition processes, and may be cured by exposure to heat or air, forexample.

The energy cell 310 and the device 220 may each be coupled to theinterposing member 330 via one or more adhesive layers 340. The adhesivelayers 340 may each comprise an electrically and/or thermally conductiveelastic dry film and/or a silicone elastomer, possibly including asilver pigmentation. The energy cell 310 and the device 220 may also oralternatively be welded to the interposing member 330 by laser weldingand/or other conventional processes.

The apparatus 300 may also include a plurality of wire bonds 350 orother type of conventional or future-developed interconnection media,such as those comprising carbon nanotubes or polyacetalynes. Each wirebond 350 couples a lead or other portion of the interposing member 330to corresponding bond pads or other contacts formed on and/or in thedevice 220. The wire bonds 350 may be employed for power supplyvoltages, regulated power conditioned and battery charging voltages,analog conditioning and sensing signals, micro-electromechanical sensingand activation signals, digital input/output signals, such as chipselect, addressing or data signals, and/or other signals between thedevice 220 and circuitry connected to the interposing member 330.

An additional wire bond 355 may couple one of the bond pads or othercontacts formed on and/or in the device 220 to the conductive member320. The wire bond 355 may be substantially similar in composition,manufacture, and assembly to the wire bond 350. The wire bond 355 mayextend through an opening, gap, or other aperture 335 in the interposingmember 330, or may be routed around the perimeter of the interposingmember 330. The wire bonds 350, 355 may comprise gold and/or otherconductive materials, and may be formed and assembled by conventionaland/or future-developed processes.

Because the conductive member 320 contacts or is electrically connectedto the electrode 110 of the energy device 310, the device 220 may beconnected to the electrode 110 via the wire bond 355. The device 220 mayalso be connected to the electrode 140 of the energy device 310 by anadditional wire bond or other similarly described 350 connection meansdiscussed above. However, in the embodiment shown in FIG. 4C, the device220 is connected to the electrode 140 via the interposing member 330 andthe adhesive layers 340. For example, a power supply contact for thedevice 220 may be on a surface of the device 220 that is contacted byone of the adhesive layers 340 (e.g., the lower surface in theorientation shown in FIG. 4C), such that the adhesive layers 340 and theinterposing member 330 collective connect the power supply contact ofthe device 220 to the electrode 140 of the energy device 310, whereinthe electrode 140 may be an anode of the energy device 310, or may beconnected to the anode of the energy device 310. Consequently, thecathode of the energy device 310, which may be the electrode 110, orwhich may be connected to the electrode 110, may be connected to aground potential contact for the device 220 through the conductivemember 320 and the wire bond 355.

Aspects of the apparatus 300 are applicable and/or readily adaptable toembodiments employing energy cells other than the energy cell 310, andalso to embodiments employing devices other than the device 220described herein. Some embodiments of the apparatus 300 may also includemore than one energy cell, each of which may be substantially similar toor different than the energy cell 310, and may also include more thanone device, each of which may be substantially similar to or differentthan the device 220. The apparatus 300 shown in FIG. 4C may also excludeone or both of the electrodes 110, 140. For example, the interposingmember 330 may be coupled directly to the topmost (relative to theorientation shown in FIG. 4A) or otherwise exposed layer of the energydevice 130, possibly through one of the adhesive layers 340 and/or othercoupling means other than the electrode 140. Similarly, the bottommostlayer of the energy device 130 (relative to the orientation shown inFIG. 4B) may be connected to the conductive member 320 directly or byone or more elements, features, components, or members other than theelectrode 110.

Referring to FIG. 5A, illustrated is a top view of at least a portion ofan embodiment of the frame 120 discussed above and designated herein bythe reference numeral 500. The frame 500 is substantially similar incomposition and manufacture to the frame 120 discussed above, andincludes an opening 502 configured to receive an energy device stack,such as that comprising the energy device layers 130 a-c describedabove.

The frame 500 also includes traces, metallization features, and/or otherelectrically conductive members herein referred to as conductive members510 (the frame 120 described above may include similar conductivemembers 510). The electrically conductive members 510 may comprisealuminum, copper, gold, tungsten, and/or other conductive materials, andmay be formed by selective deposition or bonding, brazing, blanketdeposition following by one or more patterning processes, and/or otherprocesses. In one embodiment, the electrically conductive members 510may have a thickness ranging between about 50 μm and about 500 μm,although a variety of other thicknesses are also within the scope of thepresent disclosure.

The electrically conductive members 510 are illustrated as beingrecessed within the surfaces of the body 505 of the frame 500, such thatthe upper or outer surfaces or profiles of the electrically conductivemembers 510 may be substantially planar or recessed within the bodysurface in which the conductive members 510 are formed. In such anembodiment, the electrically conductive members 510 may be formed byforming recesses in the frame body 505, such as by etching, lasermachining, and/or other processes, and subsequently filling the recesseswith conductive material, possibly followed by one or morechemical-mechanical polishing or planarizing processes and/or otherplanarizing processes. In other embodiments, the electrically conductivemembers 510 may be only partially recessed within the surfaces of theframe body 505, thereby at least partially protruding from the surfacesof the body 505. In other embodiments, the surfaces of the body 505 maybe substantially planar and the electrically conductive members 510 maymerely be formed thereon.

The electrically conductive members 510 include a electricallyconductive member 510A which comprises one or more perimeter portionssubstantially surrounding the opening 502 or otherwise configured tocontact an electrode component coupled to the frame 500 and/or anoutermost energy device layer located in the opening 502 adjacent theelectrically conductive member 510A. The electrically conductive member510A also includes one or more extension portions 511A extending betweenthe perimeter portions thereof and a spanning conductive member 510Cshown more clearly in FIG. 5B.

The electrically conductive members 510 also include a conductive member510B which comprises one or more perimeter portions substantiallysurrounding the opening 502 but electrically isolated from theelectrically conductive member 510A, such as by a gap 515 comprisingair, inert gases, other dielectric materials, or a vacuum. Theconductive member 510B may substantially or at least partially conformto the electrically conductive member 510A, although the conductivemember 510B may be offset radially outward from the conductive member510A. Ends 512 of the conductive member 510B may terminate on opposingsides of the extension portion 511A of the electrically conductivemember 510A. The conductive member 510B may also include one or moreextension portions 511B extending between the perimeter portions thereofand an additional spanning conductive member 510D shown more clearly inFIG. 5D. The extension portions 511A, 511B of the electricallyconductive members 510A, 510B may be located at opposite, possiblysubstantially parallel ends or sides of the frame 500, as shown in FIG.5A, although in other embodiments the extension portions 511A, 511B ofthe electrically conductive members 510A, 510B may be located onadjacent, possibly perpendicular ends or sides of the frame 500.

Referring to FIG. 5B, illustrated is a left side view of the frame 500shown in FIG. 5A. The spanning conductive member 510C includes one ormore portions collectively or each individually spanning the thicknessof the frame body 505, thereby connecting the extension portion 511A ofthe electrically conductive member 510A and an additional conductivemember 510E shown more clearly in FIG. 5D.

Referring to FIG. 5C, illustrated is a right side view of the frame 500shown in FIG. 5A. The spanning conductive member 510D includes one ormore portions collectively or each individually spanning the thicknessof the frame body 505, thereby connecting the extension portion 511B ofthe electrically conductive member 510B and an additional conductivemember 510F shown more clearly in FIG. 5D.

Referring to FIG. 5D, illustrated is a bottom view of the frame 500shown in FIG. 5A. The electrically conductive members 510 includeconductive member 510F which comprises one or more perimeter portionssubstantially surrounding the opening 502 or otherwise configured tocontact an electrode component coupled to the frame 500 and/or anoutermost energy device layer located in the opening 502 adjacent theconductive member 510F. The conductive member 510F also includes one ormore extension portions 511F extending between the perimeter portionsthereof and the spanning conductive member 510D shown more clearly inFIG. 5C.

The electrically conductive members 510 also include conductive member510E which comprises one or more perimeter portions substantiallysurrounding the opening 502 but electrically isolated from theconductive member 510F, such as by a gap 517 comprising air, inertgases, other dielectric materials, or a vacuum. The conductive member510E may substantially or at least partially conform to the conductivemember 510F, although the conductive member 510E may be offset radiallyoutward from the conductive member 510F. Ends 514 of the conductivemember 510E may terminate on opposing sides of the extension portion511F of the conductive member 510F. The conductive member 510E may alsoinclude one or more extension portions 511E extending between theperimeter portions thereof and the spanning conductive member 510C shownmore clearly in FIG. 5B. The extension portions 511E, 511F of theconductive members 510E, 510F may be located at opposite, possiblysubstantially parallel ends or sides of the frame 500, as shown in FIG.5D, although in other embodiments the extension portions 511E, 511F ofthe conductive members 510E, 510F may be located on adjacent, possiblyperpendicular ends or sides of the frame 500.

Although not illustrated, the spanning conductive member 510C maycomprise more than one laterally offset member each spanning the leftside of the frame body 505, although such a configuration may alsorequire that the electrically conductive members 510A, 510E eachcomprise more than one extension portion extending from their respectiveperimeter portions. Similarly, the spanning electrically conductivemember 510D may comprise more than one laterally offset member eachspanning the right side of the frame body 505, although such aconfiguration may also require that the electrically conductive members510B, 510F each comprise more than one extension portion 511B, 511Fextending from their respective perimeter portions.

As in the embodiment shown in FIGS. 5A-5D, the patterns of theelectrically conductive members 510A, 510F may be substantiallyidentical or similar, or mirror images, depending upon the orientationsemployed for such a comparison. The patterns of the electricallyconductive members 510B, 510E may be likewise similar, as well as thepatterns of the conductive members 510C, 510D.

Referring to FIG. 5E, illustrated is an exploded perspective view of atleast a portion of an embodiment of an apparatus 550 according toaspects of the present disclosure. The apparatus 550 is one environmentin which the frame 500 shown in FIGS. 5A-5D may be implemented. Theportion of the apparatus 550 shown in FIG. 5E includes an energy cell560 having an energy device (such as energy device 130 described above)formed or otherwise positioned in the frame 500, as well as electrodes110, 140 on opposing sides of the energy device. The energy cell 560 maybe substantially similar to the apparatus 100 shown in FIG. 1C and/orthe apparatus 100B shown in FIG. 2D. By example, the electrodes 110, 140may be coupled or otherwise secured to the frame 500 by Nd:YAG lasersoldering or active brazing. However, for the sake of clarity, theelectrodes 110, 140 are shown in a disassembled configuration in FIG.5E.

The perimeter of the electrode 140 may substantially conform orotherwise correspond to the electrically conductive member 510A shown inFIG. 5A, or at least to the perimeter portions of the electricallyconductive member 510A (e.g., excluding the extension portion 511A).Accordingly, upon assembly, the electrode 140 may electrically contact asubstantial portion of the conductive member 510A and/or an electrodelayer or other outermost layer of the energy cell 560. However, theperimeter of the electrode 140 may also be offset laterally inwardrelative to the electrically conductive member 510B shown in FIG. 5A,such that electrode 140 may be electrically isolated from theelectrically conductive member 510B. Otherwise, the electrode 140 maysubstantially be as described above.

Similarly, the perimeter of the electrode 110 may substantially conformor otherwise correspond to the electrically conductive member 510F shownin FIG. 5D, or at least to the perimeter portion of the electricallyconductive member 510F (e.g., excluding the extension portion 511F).Accordingly, upon assembly, the electrode 110 may electrically contact asubstantial portion of the electrically conductive member 510F and/or anelectrode layer or other outermost layer of the energy cell 560.However, the perimeter of the electrode 110 may also be offset laterallyinward relative to the electrically conductive member 510E shown in FIG.5D, such that electrode 110 may be electrically isolated from theelectrically conductive member 510E. Otherwise, the electrode 110 maysubstantially be as described above.

Referring to FIG. 5F, illustrated is an exploded perspective view of atleast a portion of an embodiment of an apparatus 555 according toaspects of the present disclosure. The apparatus 555 is one environmentin which the apparatus 550 shown in FIG. 5E may be implemented. Theportion of the apparatus 555 shown in FIG. 5F includes an embodiment ofthe apparatus 550, or another type of energy cell or energy storagedevice, as well as devices 570, 580 to be packaged on opposing sides ofthe apparatus 550. However, for the sake of clarity, the devices 570,580 are shown in a disassembled configuration in FIG. 5F. The devices570, 580 may be substantially similar to the devices 220 or otherdevices described above as being packaged with an energy device or cell.The apparatus 555 may also include only one of the devices 570, 580. Insuch embodiments, one or more of the electrodes 110, 140 shown in FIG.5E, and/or one or more of the conductive members 510 shown in FIGS.5A-5D, may be omitted. For example, if the device 580 is coupled to oneside of the apparatus 550, but the apparatus 555 does not include adevice coupled to the opposing side of the apparatus 550 (such as thedevice 570), the electrode 110 shown in FIG. 5E may be omitted.

Referring to FIG. 5G, illustrated is a bottom view of at least a portionof one embodiment of either of the devices 570 and 580 (designated inFIG. 5G as “570/580”) that can be attached to either of the electrodeelements 110 and 140 shown in FIG. 5F. On the outside perimeter of thedevice 570/580 (e.g., the outside perimeter of the device die), I/Ocontacts 571 may, for example, be constructed utilizing flip-chipevaporated Under Bump Metallization (UBM) and conductive adhesivestencil techniques. Within the center of the device 570/580 (e.g., thecenter of the device die), a large area single contact point 572 or aplurality of multiple contact points can similarly be formed utilizingsimilar techniques. For assembly of the device 570/580 to the assembledpower source (e.g., apparatus 550 shown in FIG. 5E), the device 570/580is flipped on top of the cell assembly 550 such that the I/O contacts571 align with the metallized and electrically conductive member 510B or510E. Contact for the large area contact points within the center of thedie can be accomplished anywhere on the electrode element 110 or 140. Acomplimentary construction technique can be utilized for assembly of asecond device 570/580 where its associated I/O contacts align with andcontact the corresponding conductive member 510B or 510E and itsassociated center contact 572 aligns with and contacts the correspondingelectrode element 110 or 140. By way of example, each of the threeassembled devices, now consisting of an energy storage cell 550 layeredbetween two devices 570/580, may be temporarily held together using anassembly tape such as Kapton® (I.E. DuPont) until an interposing,conductive adhesive can be cured, such as at about 150° C. for fifteento thirty minutes.

Aspects of the apparatus 500, 550, 555 are applicable and/or readilyadaptable to embodiments employing energy cells other than those shownin FIGS. 5A-5G, and also to embodiments employing devices other than thedevices shown in FIGS. 5A-5G or otherwise described herein. Embodimentsof the apparatus 500, 550, 555 may also include more than one energycell, each of which may be substantially similar to or different thanthose shown and described herein, and may also include more than onedevice, each of which may be substantially similar to or different thanthe devices shown and described herein.

Referring to FIG. 5H, illustrated is a perspective view of the apparatus555 shown in FIG. 5F after the devices 570/580 have been assembled toopposing surfaces of the energy storage cell 550. In the illustratedexample, the footprint of each of the devices 570/580 substantiallyconforms to the footprint of the energy storage cell 550, both in regardto shape and surface area. However, one or both of the devices 570/580may alternatively have a footprint that differs in shape and/or surfacearea relative to the footprint of the cell 550, whether or larger orsmaller.

Referring to FIG. 6A, illustrated is a schematic view of at least aportion of an embodiment of an apparatus 600A according to aspects ofthe present disclosure. The apparatus 600A includes a device 610packaged with and powered at least partially by an energy storage device620 according to aspects of the present disclosure. The device 610 maybe substantially similar to the device 220 described above, otherdevices described herein, and/or other devices within the scope of thepresent disclosure. The device 220 may also include more than onediscrete device, die, or chip, or may itself be or comprise an apparatussubstantially similar to the apparatus 600A.

The energy storage device 620 may be substantially similar to one ormore of the energy devices or cells described above. However, ratherthan merely generating the energy provided to at least partially powerthe device 610, the energy storage device 620 is also electricallycoupled to an energy source 630, such as by wires or other electricallyconductive members 640, which may be configured to recharge the energystorage device 620.

The energy source 630 may be or include a nuclear battery, such asdescribed in “The Daintiest Dynamos,” IEEE Spectrum, September 2004,Amit Lal and James Blachard, the entirety of which is herebyincorporated by reference herein. The energy source 630 may additionallyor alternatively be or include a MEMS based thin-film fuel cell, such asdescribed in U.S. Pat. No. 6,638,654 to Jankowski, et al., the entiretyof which is hereby incorporated by reference herein. The energy source630 may additionally or alternatively be or include RF energy collectorssimilar to RFID Tag and Electronic Product Code (EPC) implementations,such as described in Technology Review, July/August 2004, pp 74,75,Erika Joniets, Massachusetts Institute of Technology (MIT), the entiretyof which is hereby incorporated by reference herein. The energy source630 may additionally or alternatively be or include a single or pluralconfiguration of photovoltaic cells, such as described in U.S. Pat. No.6,613,598 to Middelman, et al., U.S. Pat. No. 6,580,026 to Koyanagi, etal., U.S. Pat. No. 6,538,194 to Koyanagi, et al., U.S. Pat. No.6,479,745 to Yamanaka, et al., U.S. Pat. No. 6,469,243 to Yamanaka, etal., or U.S. Pat. No. 6,278,056 to Sugihara, et al. These patents, intheir entirety, are hereby incorporated by reference herein. The energysource 630 may additionally or alternatively be or include one or moreof: a radioactive generator, a ferro-electric or magnetic generator, alead zirconate titanate (PZT) electricity generating ceramic device, ora MEMs based petro-chemical internal combustion engine with an electricgenerator, an elastomeric generator, or a piezoelectric generator, orother acoustic or mechanical vibration piezoelectric energy harvesters,among others.

Referring to FIG. 6B, illustrated is a schematic view of at least aportion of another embodiment of the apparatus 600A shown in FIG. 6A,herein designated by the reference numeral 600B. The apparatus 600B maybe substantially similar to the apparatus 600A, except that the energysource 630 may be directly coupled to the energy storage device 620 inthe apparatus 600B. For example, the energy source 630 may be coupled tothe energy storage device 620 by one or more layers which may besubstantially similar to the interface layer 230 and/or the adhesivelayers 340 described above. Consequently, the energy source 630 may beadjacent to or otherwise centrally located with the energy storagedevice 620, whereas the energy source 630 may be located remote from theenergy storage device 620 in the apparatus 600A shown in FIG. 6A.

Having described the construction techniques utilized to integrate amicro-sale, nano-scale, or other miniature Energy Storage Device (ESD)with a semiconductor package, the following paragraphs focus onpotential applications or implementations for such an integrated device(e.g., in the marketplace). Because of the broad base of applications orimplementations for integrated devices as described herein, the overallapplicable, product-driven markets where such devices may be applicablecould be, but are in no way construed or interpreted to be limited to,market segments typically described as “automotive,” “military,”“industrial,” “telecommunications,” “medical” and “consumer.” For eachof these market segments, the following paragraphs are included asdiscussion by way of product examples in each market segment, suggestedproduct solutions which may utilize an integrated circuit and ESD, orintegrated circuit-ESD-energy generator combination of constructedcomponents which may possess functional, useful and/or beneficialoperational advantages.

Applications of an integrated ESD device according to aspects of thepresent disclosure and applicable to the automotive market segmentinclude security keys, locks and ignition systems,automobile-body-mounted crash sensors, tire air pressure sensors, orconsumable product status sensors and indicators, among others. Oneexample is a device employed with a typical automotive air intake line,where a low cost air-pressure sensor which measures air pressure can beutilized to indicate the volume of airflow into the carburetor. Acontaminated or failing air filter may yield a measurable increase inair intake pressure from a known airflow operating condition, which maybe empirically measured if a sensor is physically located on an airintake path or manifold just past the air filter element. In such animplementation, a single integrated package containing a MEMS type ofpressure sensor, an ESD rechargeable battery, and a MEMS based kineticpower source, all collocated and encapsulated or otherwise integrallypackaged into an automotive-ergonomic compatible package, may be placedon an air inlet hose or manifold located in a position following the airfilter but in front of the carburetor (or other air inlet to theengine). An autonomous, self-powered pressure sensor of this type maygive indication to the vehicle owner/operator of a filter-replacementrequirement, such as via illumination of a light emitting diode (LED).

Military applications for an integrated ESD type of device according toaspects of the present disclosure include countermeasure devices such asinfrared chafes, smart munitions on small caliber munitions rounds,anti-fuse based solid state detonators, or consumable chemical orbiological agent detectors. For example, a contemporary militaryaircraft countermeasure to an adversarial firing of a heat-seeking orinfrared-guided missile is the use of infrared (IR) generating chafes.The chafe is a small device typically containing a hydrocarbon-basedfuel that, when ignited, bums hot enough to give off an emission ofthermal infrared energy. This infrared energy signature is intended tobe of sufficient luminescent quantity, and of sufficient time duration,to duplicate the energy signature of the aircraft jet engine. Thediversionary and decoy properties of the deployed chafes cause theheat-seeking guidance system of the adversarial missile to becomeconfused as to which glowing object is the targeted aircraft engine. Asthe aircraft maneuvers away from the deployed chafes, the infraredsignature of the chafes becomes more predominate than the IR emissionsignature of the targeted jet engine, and the missile subsequentlyfollows the new, brighter signature of the decoy chafes. Thisdiversionary and decoy mechanism of substituting the infrared signatureof chafes for the infrared signature of targeted jet engines is aneffective countermeasure in a threatening and potentially lethalsituation where both the aircraft and its pilot avoid the catastrophe ofbeing destroyed by an adversary's guided missile.

The chafes are typically a fueled, pyrotechnic device. An ESD-basedintelligent chafe, constructed according to aspects of the presentdisclosure, may be produced in virtually any favorable airbornegeometry. As chafes typically have flat- and rounded-disk form factors,each chafe disk may be configured to contain an ESD type of device whichallows for a delayed-fuse activation of a high-intensity, infrared lightemitting source. According to aspects of the present disclosure, eachchafe disk may contain one, two or more conductive elements that, whenaligned into a launching cylinder, are utilized to electronicallyactivate the infrared emitting source on the disk. When stacked innumbers and aligned in a firing cylinder, the chafes can be launched orpropelled from the cylinder when activated. Potential benefits ofutilizing this method of countermeasure include the geometric coveragearea of the infrared signature left behind the targeted aircraft by thelaunched chafes, their programmable timing for activation delay fromlaunch, their illumination duration, and their intensity of the infraredemission in each chafe.

Industrial applications of ESD based devices according to aspects of thepresent disclosure include a variety of autonomous transducers andsensors, as well as manufacturing tracking, shipping, and productauthenticity implementations. For example, one implementation may entailproducts which are manufactured utilizing highly-automated assemblyprocesses, such as those processes which are substantially automatedfrom beginning to end, including where an assembly process progresseswith the insertion of various subassemblies into a manufacturing processcarrier or tray. For purposes of discussion, the carrier or tray will bereferred to hereafter as a “handler.”

Because of the fully- or substantially-automated nature of themanufacturing process, human intervention may be kept at a minimum. Avariety of sensors located within the conveyor system or assemblystation of an assembly process may be utilized as quality-feedbackmechanisms, such as to ensure that each process step is concluded withthe desired result. At each step of the assembly or other manufacturingprocess, the sensors may allow the product to be either accepted andforwarded to the next assembly stage, or to be rejected from theassembly process entirely.

The continued acceptance or rejection of an assembled product during amanufacturing process may be known as “yield.” Yield is a percentagecalculation indicative of a ratio measure of the amount of product(e.g., production units) that are accepted through each process stagedivided by the total number of units that started through the processstage. For example, the desired outcome may be to keep the automatedprocess within sufficient quality parameters that the yield metricremains as high as possible. Because the automated manufacturing processmay remove as much human intervention as possible, the handler may becreated such that it may contain an intelligent measurement andcommunications device whereby the assembly performance results of eachstage of the manufacturing process can be acquired and stored.

An integrally-packaged ESD device according to aspects of the presentdisclosure and configured for this exemplary industrial implementationmay be molded or mounted into the handler. The device may contain asingle or series of integrated circuits comprising, for example, amicro- and/or nano-technology-based, articulated MEMS- or NEMS-basedgyroscope to detect assembly orientation. The device may contain amulti-function microcontroller interface that is capable of analogsensing, such as may be configured to sense temperature. Themicrocontroller may additionally be configured to perform conversion ofthe analog sensing signal into digital data, and the microcontroller orother portion of the device may also include memory for the storage ofthe digital data.

For example, during the assembly process, the handler may hold theassembly for a spray deposition process in such a way that roboticorientation of the device must be measured within six degrees offreedom, for specific amounts of time, and at specific spray depositiontemperatures. Following the spray deposition process, a high-temperaturecuring process may involve similar actuation of the handler in sixdegrees of freedom and with specific amounts of time at specific curingtemperatures. Upon entry to this particular manufacturing stage, theintegrated circuit of the integrated ESD device package according toaspects of the present disclosure may be activated through the use of amagnetic Hall Effect transistor, for example. Upon activation, themicrocontroller may begin to sense signals from the MEMS gyroscopeand/or the temperature sensor and, possibly with each measurement cycle,store the results of the measurement within a static random accessmemory of the microcontroller or other portion of the integrated ESDdevice.

With the microcontroller now active, the handler may proceeds throughthe spray deposition stage followed by the high-temperature curingstage. In each stage, data indicative of the condition of the handlerorientation and temperature may be collected and/or stored in theintegrated ESD device of the present disclosure. Upon completion of thehigh-temperature curing stage, the handler may be exposed to an RF fieldwithin sufficient proximity to allow for the initiation and transfer ofdata from the integrated ESD device of the handler to a processcontroller.

The process controller may read the digitally encoded data and, possiblythrough the use of the aforementioned Hall Effect switch, turn off orotherwise deactivate the integrated ESD device. With the data from theintegrated ESD device contained in the handler, the process controllermay examine the data contained in the process assembly handler and makea determination, possibly based on predetermined manufacturing processattributes, whether the assembly contained in the handler hassuccessfully completed the manufacturing process stage. If thedetermination is positive, the handler and its associated assembly maybe allowed to pass to the next assembly stage. If the determination isnegative, the assembly may be rejected from the manufacturing processand discarded from the handler. Further, if the determination isnegative, and once the assembly is removed from the handler, the handlermay be allowed to return to the start and be reused for a newsubassembly to pass through the same manufacturing stages.

Within the telecommunications market segment, applications orimplementations for integrated ESD-device packages may exist interrestrial, cellular, radio, copper-line-based, and/or high-speedoptical networks or network components. For example, one suchimplementation may entail a single, highly-reliable, opticalcross-connect switching apparatus. From a historical perspective, systemcomponents contained within an optical communications network typicallyemploy conversion processes for translating between optical andelectrical signals. Further, the efficiency of an optically-switchednetwork device can be measured by the amount of time that is necessaryto perform the conversion of optical signals of an inbound optical portto an inbound electrical data path, the switching of the inboundelectrical data path to an outbound electrical data path, and theconversion of the outbound electrical data to an outbound optical port.In addition, this switching process must be highly reliable.Contemporary definitions of telecommunications reliability may include astandard of 99.9999% functional operation, among other examples. Whilemany producers of optically-switched network equipment have developedproducts which meet the reliability standards as mentioned, switchingperformance may remain limited by the two-step electronic data path ofoptical signal conversion processes.

In considering the elimination of the electrical-optical conversionprocesses to optimize optical switching, an integrated ESD devicepackage of the present disclosure, integrating an ESD and a micro- ornano-technology-based, cantilevered and articulated MEMS- orNEMS-actuated mirror device in a single package, may be utilized as aphotonic switch to cross-connect inbound optical data to an outboundoptical port while minimizing the attenuation loss of the interfacebetween the photonic interconnect. Further, to sustain thehigh-reliability operating performance standard of 99.9999%, such anintegrated ESD device package may be utilized to sustain the actuatedmirror assembly's position of reflection between the inbound andoutbound optical ports during periods of fluctuating electricalbrown-out or loss of power. The integrated ESD device package mayadditionally or alternatively be configured to power one or moreon-board optical amplifiers employed to minimize the photonicattenuation. As photonic switching elements are typically deployed in anN element by M element matrix format, the integrated ESD device packageof the present disclosure may become more attractive for theincorporation of redundant energy in larger switching matrix sizes.

The medical market segment provides the opportunity for autonomouslyoperating micro- and nano-technology derived MEMS- and NEMS-fabricateddevices in applications of organ and muscle stimulators, bone and tissuegrowth stimulators, hormonal or enzyme level detectors, drug dispensers,neurological activity sensors, viral and bacteriological detectors, andautomatic genetic or chemical assays, among others. One product exampleutilizing aspects of the present disclosure may be achieved for adisposable temperature thermometer. Utilizing an integrated ESD-devicepackage of the present disclosure, integrating a temperature sensorlocated on a surface of the ESD frame with and a microcontroller andlow-cost, flexible, organic display system located on an oppositesurface of the ESD frame, a highly-accurate digital thermometer may beenclosed in low-cost, ABS-type injection molded or polyester film formedplastic which can be attached to a patient's skin.

Any number of possible activation methods may be employed to begin themeasurement operation, including mechanical, resistance, capacitive,piezoelectric, and/or pressure switching, or a combination thereof. Uponactivation, the microcontroller may begin the measurement of thetemperature induced by an integrated or external thermal sensor andsubsequently display the results in any of a variety of formats based onthe design of the display mechanism. The display mechanism may include aseries of individually colored organic light emitting diodes (LEDs)and/or other LEDs, a plasticized, color, thin-film display for a bartype display, or a thin-film transistor digital display of colorednumerals which display legible digits, among other display types. Oncethe measurement cycle is completed, the thermometer can be removed fromthe patient's skin and possibly discarded.

Applications or implementations for integrated ESD-device packagingaspects of the present disclosure regarding products for consumermarkets include sporting goods, gaming or casino tokens, jewelry,educational assistance and personal productivity tools. One exemplaryimplementation is a “mood” ring. While a mood ring cannot reflect anindividual's mood with any real scientific accuracy, it can indicate anindividual's involuntary physical reaction to an emotional state. Thestone in a mood ring is typically a clear glass stone sitting on top ofa thin sheet of liquid crystals. Contemporary nano-technology and/ororganically-derived liquid crystal molecules can be very sensitive,changing orientation position or twist according to changes intemperature. This change in molecular structure affects the wavelengthsof light that are absorbed or reflected by the liquid crystals,resulting in an apparent change in the color of the stone. The typicalcolors of the mood ring vary, by coolest to warmest temperature, fromdark blue, blue, blue-green, green, amber, grey, and black, for example.

Relative to aspects of the integrated ESD-device packaging describedherein, a mood ring can be configured such that one surface of the ESDframe contains a kinetic energy harvester that is utilized to convertmotion of hand or finger movements into electric energy. An opposingsurface of the ESD frame may contain one or more low-power or other LEDsfor illumination with a laminated, liquid crystal display that iscolor-sensitive to heat and/or electrical stimulus. The ESD package maybe positioned inside the body of the ring band, and a transparent,artificial gem store may be placed on the top of the ring band opening.As the ring conducts heat and transforms motion of the wearer toelectricity, the liquid crystal display may change colors depending onthe finger temperature and electrical energy received from the kineticenergy harvester contained in the ESD-device package positioned beneaththe transparent stone.

For example, the color green, which signifies “average” on a mood ringcolor-scale, may be calibrated to the average person's normal fingersurface temperature, such as about 82° F. (28° C.). By amplifying theincreased or decreased thermal effects and/or by utilizing thetransformed kinetic energy stored as electricity in the ESD, theilluminated liquid crystals may become visibly more distinguishable asthe thermal effect changes their color.

Other implementations or applications within the scope of the presentdisclosure, whether within the above-described market segments orotherwise, may utilize an integrated battery-device package that may notbe substantially planar, as in the examples depicted in the Figuresdiscussed above. In contrast, the integrated package may besubstantially spherical or otherwise non-planar. One such exampleincludes an ESD having at least one substantially spherical surfacemated with a substantially spherical semiconductor device, such as thosedeveloped by Ball Semiconductor, Incorporated. Spherical geometry of theESD and device integrated therewith may allow one or more circuits to belocated on a spherical semiconductor or other integrated circuit devicesubstrate and be routed or wound around an appropriate portion of thespherical or otherwise non-planar surface, such as may be utilized tocreate a property of inductance. The added semiconducting materialfeature dimension of height may allow greater inductance values comparedto those achievable on substantially planar chip surfaces. Additionally,such windings can be utilized as an antenna, such as to provide orsupport wireless communication between sensors implanted in the body andexternal, peripheral devices, for example. Such configurations mayprovide sensors with true, three-dimensional data acquisitioncapabilities. Moreover, sensors placed on the spherical surface may beconfigured to perform multidirectional sensing, and may be capable ofgenerating data that is more comprehensive than conventional sensors.

Additionally, embodiments in which the integrated ESD-device package isconfigured to be implanted into a living human or other animal mayeliminate the wires, cables, and tubes that conventionally encumber apatient. For example, the integrated ESD-device package may beconfigured as a self-powered sensor that, for example, may be swallowedby a patient to monitor vital signs internally, possibly withthree-dimensional sensing capability. Such implementations of theintegrated ESD-device package aspects of the present disclosure may alsobe utilized, for example, in operating rooms to track surgicalinstruments and sponges embedded with or coupled to embodiments of theintegrated ESD-device package, or as embedded in surgical instruments toprovide limited or single-use corrective processes which may aid in thecorrection of a patient's medical or surgical condition.

For example, when a patient is subjected to major surgery, surgeons orother medical professionals are required to conduct a “sponge count”before opening and before closing the patient, thereby ensuring thatnone of the surgical sponges or other surgical equipment isinadvertently left inside the patient. The count is typically performedby hand and, in the case of a miscount, x-rays are required to locatethe missing sponge or other surgical implement. In contrast, anelectronically-tagged instrument incorporating an integrated ESD-devicepackage according to aspects of the present disclosure may be locatedwith more simpler, potentially hand-held scanners, including thoseoperable via radio-frequency or other wireless protocols that posesignificantly reduced health-risks to the patient and surgical teamcompared to the use of x-ray apparatus.

Another example is a limited use, potentially specialized, sphericalscalpel which may be configured in conjunction with an integrallypackaged or otherwise associated ESD. Such a scalpel may be utilized tocauterize arteries and aid in the elimination of bleeding, among otherpotential uses and benefits. Additional implementations utilizing thespherical configuration described above include sensor-tipped cathetersor guide wires, wireless electrodes, implantable neuro-stimulationdevices, and a proprietary chromatography technique. Applications formicro- and nano-technology derived and/or other MEMS- and NEMS-basedsensing elements may also include implant markers, sensor-tippedcatheters, and swallowable vital sign sensors.

In addition to reexamining the optimal shape of sensing devices,dramatic reduction in sensor size is making new applications possible.Integrated Sensing Systems, Inc. (Ann Arbor, Mich.) is developing apressure sensor that is only 0.25 mm wide, which is small enough to fitinside the eye of a needle, as well as inside most catheters. A singlesensor may be used to measure the internal pressure of organs or wounds.With a pair of the devices, a pressure drop across an arterialobstruction may also be measured. A sensor array may also be utilized tocharacterize flow across long arterial or intestinal sections. Themicro-scale sensor may provide a pressure range between about 0 andabout 1200 torr, with a resolution of less than about 0.3 torr.

Referring to FIG. 7, illustrated is a block diagram of at least aportion of an embodiment of apparatus 700 according to aspects of thepresent disclosure. The apparatus 700 may be a wireless deviceconfigured to be permanently or temporarily implanted or attached to aliving human, bovine, equine, caprine, porcine, ovine, canine, feline,avian, or other animal. The apparatus 700 may also be a wireless deviceconfigured to be permanently or temporarily implanted or attached to ananimal carcass, such as in a meat-processing facility.

The apparatus 700 may be configured as a wireless tracking device, suchas to track the movement of a living animal, including in real-time. Theapparatus 700 may also or alternatively be configured as a wirelessdevice for sensing a characteristic of the animal or environment inwhich the apparatus 700 is deployed. The apparatus 700 may also beconfigured to transmit information pertaining to the sensedcharacteristic, or to transmit information pertaining to thecharacteristic as sensed by another device or apparatus in communicationwith the apparatus 700.

For example, the apparatus 700 may be configured to be utilized as adevice for transmitting heart waveform signals as part of anelectrocardiogram test procedure (ECG), or as a sensor on an aircraftwing which wirelessly communicates with a peripheral base unit. However,the myriad implementations, applications and configurations of theapparatus 700 within the scope of the present disclosure are not limitedto these exemplary embodiments or functions.

The apparatus 700 includes one or more antenna 710, an integratedcircuit (IC) chip or device 720, and an energy supply or energy source730. The antenna 710, IC chip 720 and energy supply 730 are enclosedwithin a packaging material 740. Each of the antenna 710, IC chip 720and energy supply 730 are electrically coupled to at least one of theother components, as indicated by the dashed arrows in FIG. 7, althoughone or more of the components may not be coupled to each of the othercomponents, contrary to the example shown in FIG. 7. Such electricalcoupling may be via one or more traces, wire bonds, contacting contactpads, electrically conductive adhesive, solder, stud bumps, and/or othermeans.

The energy supply 730 may be collocated with the IC chip 720 within thepackaging material. For example, the energy supply 730 and the IC chip720 may be arranged substantially side-by-side, such as the energydevice 130 and each of the devices 570, 580 shown in FIG. 5H. A surfaceof the energy supply 730 may be in substantial contact with a surface ofthe IC chip 720, whether directly or via a thin layer employed, forexample, to improve adhesion and/or electrical characteristics of thetwo components relative to each other. However, the collocation of thetwo components does not necessarily require or imply that the footprintsof the components are either substantially similar or aligned (e.g.,rotation or “clocking” relative to each other). In addition, the antenna710 may be similarly collocated with one or both of the energy supply730 and the IC chip 720.

The IC chip 720 and the energy supply 730, and possibly the antenna 710,are collectively formed, fabricated, assembled, bound, co-joined, and/orotherwise oriented in such collocated arrangement prior to beingencapsulated within the packaging material 740. In contrast,conventional packaging processing can entail an initial packagingprocess to encapsulate the IC chip 720, such as after bonding the ICchip 720 to a lead frame, and an additional packaging process toencapsulate the packaged IC chip 720 with an energy supply 730. Thisconventional packaging method can be disadvantageous, such as where theadditional packaging process excessively adds bulk or height to thefinished product, or where the additional packaging process presents anenvironmental risk to the previously packaged IC chip 720 (such as toexposure to high temperature, stress build-up, additional handling,and/or other factors).

The antenna 710 is configured as a means for transmission and/or receiptof wireless signals across the boundary between the outer surface of thepackaging material 740 and the surrounding environment. For example, theantenna 710 may comprise a member having a rod-shaped, ring-shaped,helical and/or other geometry, and may comprise aluminum, copper, goldand/or other electrically conductive materials. The antenna 710 maytransmit and/or receive signals wirelessly between sensors and/oractuators located within and/or externally to the device 700 andexternal peripherals. Such wireless communication may be via IEEE802.15.1 (also known as Bluetooth), ultra-wide-band (UWB), IEEE 802.16(also known as WiMAX), IEEE 802.11b (also known as WiFi), IEEE 802.11a,IEEE 802.11g, and/or other wireless communication protocols.

The antenna 710, or an array thereof, may be physically secured withinthe apparatus 700, such as to the integrated circuit 720 and/or theenergy source 730, whether directly or indirectly, by adhesive, bonding,brazing, clamps and/or other mechanical fasteners, and/or by othermeans. For example, the antenna 710 may be attached to the IC chip 720by micro- or nano-technology-based deposition or polysilicon etchprocessing. The length, overall dimensions, or other dimensions of theantenna 710, each antenna 710 where multiple are employed, or an arrayof antenna 710 where employed, may range between about 1 mm and about 3mm, although other dimensions are also within the scope of the presentdisclosure.

The antenna 710 may include, or be considered to include, some degree ofcircuitry, such as to allow the wireless transmission or receipt ofsignals, and may include some aspects of wired and/or wirelessnetworking. The signals transmitted via the antenna 710 may include datarelated to, for example, one or more characteristics of the environmentin which the apparatus 700 is employed, such as may be sensed by aportion of the IC chip 720. The signals transmitted via the antenna 710may include data related to, for example, a status of the IC chip 720,energy supply 730, and/or other portion of the apparatus 700.

The IC chip 720 may comprise a plurality of active and/or passivesilicon- and/or other semiconductor-based devices, such as the devices222 described above with respect to FIG. 3. The IC chip 720 may besubstantially similar to the device 220 shown in FIG. 4C, the devices570/580 shown in FIG. 5F, and/or the device 555 shown in FIG. 5H. The ICchip 720 and may include circuitry configured to manipulate signalsreceived from a sensor component and/or to be sent to an actuatorcomponent, whether such sensor and actuator components are locatedwithin the IC chip 720, otherwise within the apparatus 700, or externalto the apparatus 700. The integrated circuit 720 may also includecircuitry configured to prepare a signal and oscillatory mechanismutilized to, for example, transmit and/or receive signals via theantenna 710, such as via one or more of the wireless protocols describedabove. The integrated circuit 720 may also be secured to the antenna710, the energy storage device 730, or both, such as via adhesive,bonding, brazing, clamps and/or other mechanical fasteners, and/or byother means.

The energy supply 730 may be or include a nuclear battery, a MEMS- orNEMS-based thin-film fuel cell, a single or plural configuration ofphotovoltaic cells, Ferro-electric or RF energy collectors which may besimilar to RFID Tag and Electronic Product Code (EPC) implementations,acoustic or mechanical vibration piezoelectric energy harvesters, and/orothers, including those described above with respect to the energydevice 630 shown in FIGS. 6A and 6B. The energy supply 730 maysubstantially include an energy storage device as described herein, ormay additionally include an energy harvesting and/or generation device.Moreover, as with the energy cell described above with respect to FIGS.1A-1C. The energy supply 730 may be directly or indirectly coupled tothe IC chip 720 and/or the antenna 710.

As mentioned above, the antenna 710 (or array thereof), the IC chip 720and the energy supply 730 may be substantially or entirely encapsulatedor otherwise enclosed within the packaging material 740. The packagingmaterial 740 may include a ceramic, plastic, metallic or otherwiseprotective and at least partially enclosing substance, such as may beintended to yield its internal components as a single, integratedpackage. For example, the packaging material 740 may have a compositionthat is substantially similar to that described above with reference tothe apparatus 300 shown in FIG. 4C.

The packaging material 740 may be substantially or essentially sealed,or may substantially or essentially seal the collocated and othercomponents of the apparatus 700, such as to prevent access by anend-user to the sealed components of the apparatus 700. The packagingmaterial 740 may also be configured or selected to have a predeterminedor otherwise appropriate environmental permeability, such as toeffectively allow the collocated energy supply 730, IC chip 720 and/orantenna 710 to perform the desired sensory, computational, and/orcommunications functions. For example, the packaging material 740 mayform a protective enclosure having an internal cavity which maysubstantially conform to an outer profile of the collocated antenna 710,energy supply 730 and IC chip 720, collectively, and may haveenvironmentally permeable transmission properties selected or configuredto permit the ingress and/or egress of electromotive and/or otherenvironmental material characteristic properties.

Referring to FIG. 8A, illustrated is a block diagram of at least aportion of an embodiment of the apparatus 700 shown in FIG. 7, hereindesignated by the reference numeral 800 a. The apparatus 800 a issubstantially similar to the apparatus 700 shown in FIG. 7 except asdescribed below. The antenna 710, the IC chip 720 and the energy supply730 of the apparatus 700 are electrically coupled, but may not bephysically coupled, despite being collocated. In contrast, the antenna710, the IC chip 720 and the energy supply 730 of the apparatus 800 aare not only electrically coupled, but are also physically coupled indirect contact. However, the direct physical contact may be via aninterposing material configured, for example, to enhance adhesion,electrical conductivity and/or electrical isolation. Moreover, theelectrical coupling between the antenna 710, the IC chip 720 and theenergy supply 730 of the apparatus 800 may be via the direct physicalcoupling described above.

Referring to FIG. 8B, illustrated is a block diagram of at least aportion of an embodiment of the apparatus 800 a shown in FIG. 8A, hereindesignated by the reference numeral 800 b. The apparatus 800 b issubstantially similar to the apparatus 800 a except as described below.The antenna 710 and the IC chip 720 of the apparatus 800 a are eachelectrically coupled and physically coupled to the energy supply 730 bydirect physical contact. However, the antenna 710 of the apparatus 800 bis not physically coupled to the energy supply 730 by direct physicalcontact. In contrast, the antenna 710 of the apparatus 800 b isphysically coupled to the IC chip 720 by direct physical contact, as“coupling by direct physical contact” is described above (a conventionfollowed in the description below), and is electrically coupled to theenergy supply 730 indirectly via the IC chip 720 and, possibly, one ormore wire bonds, traces, and/or other conductive members. Nonetheless,the antenna 710, the IC chip 720 and the energy supply 730 are eachelectrically coupled to the other two components, whether directly orindirectly, such as the electrical coupling of the antenna 710 and theenergy supply 730 indicated in FIG. 8B by the dashed arrows.

In an implementation similar to the apparatus 800 b, the energy supply730 may interpose and be physically and electrically coupled to the ICchip 720 and the antenna 710 by direct physical contact, in contrast tothe IC chip 720 interposing and being physically and electricallycoupled to the energy supply 730 and the antenna 710 by direct physicalcontact as shown in FIG. 8B.

Referring to FIG. 8C, illustrated is a block diagram of at least aportion of an embodiment of the apparatus 800 a shown in FIG. 8A, hereindesignated by the reference numeral 800 c. The apparatus 800 c issubstantially similar to the apparatus 800 a except as described below.That is, the antenna 710 is directly coupled by physical contact to theIC chip 720, but the antenna 710 and the IC chip 720 are eachindividually coupled directly to a separate energy supply 730 by directphysical contact. In a similar implementation, the separate energysupplies 730 are actually different portions of the same energy supply,such that the antenna 710 and the IC chip 720 are each directly coupledby physical contact to a corresponding portion of the energy supply 730.

Referring to FIG. 8D, illustrated is a block diagram of at least aportion of an embodiment of the apparatus 800 b shown in FIG. 8B, hereindesignated by the reference numeral 800 d. The apparatus 800 d issubstantially similar to the apparatus 800 b, except as provided below.That is, in the apparatus 800 d, the energy supply 830 physicallyinterposes and directly contacts the IC chip 720 and the antenna 710, incontrast to the IC chip 720 interposing and directly contacting theantenna 710 and the energy supply 730, as in the apparatus 800 b. Theantenna 710 and the IC chip 720 of the apparatus 800 d are eachindependently coupled directly to opposing sides of the energy supply730 by direct physical contact, but are not coupled together by directphysical contact. However, the apparatus 800 d includes an electricalconduit 850, such as an electrically conductive metallic substance,spanning between the antenna 710 and the IC chip 720 to provideelectrical connection. All four components (710, 720, 730 and 850) aresubstantially or essential encapsulated or otherwise enclosed within thepackaging material 740.

Referring to FIG. 8E, illustrated is a block diagram of at least aportion of an embodiment of the apparatus 800 c shown in FIG. 8C, hereindesignated by the reference numeral 800 e. The apparatus 800 e issubstantially similar to the apparatus 800 c except as described below.For example, in the apparatus 800 e, the energy storage device 730includes of two components 730 a and 730 b, the antenna 710 is directlycoupled to the first component 730 a by direct physical contact, and theIC chip 720 is directly coupled to both components 730 a and 730 b.Operational energy required by the antenna 710 may be provided by theenergy supply component 730 a, whereas operational energy required bythe IC chip 720 may be provided by either or both of the energy supplycomponents 730 a and 730 b, whether continuously or in tandem. Forexample, the energy usage requirements of the IC chip 720 may besubstantially greater (in magnitude and/or duration) relative to theenergy usage requirements of the antenna 710. Alternatively, if theantenna 710 has higher energy usage requirements than the IC chip 720,the position of these two components within the configuration of theapparatus 800 e may be switched. However, in either case, the antenna710 may be electrically coupled to the IC chip 820 indirectly by one ormore conductive members, as indicated by the dashed arrow in FIG. 8E.Additionally, the separate energy supply components 730 a and 730 bshown in FIG. 8E may actually be different portions of a single energysupply, such as may be segmented, sectored, dedicated or otherwisecorrespond to the different components 710, 720 of the apparatus 800 e.

Referring to FIG. 9A, illustrated is a schematic view of at least aportion of an embodiment of a system 900 according to aspects of thepresent disclosure. The system 900 is one environment in which theapparatus 700, 800 a, 800 b, 800 c, 800 d, and/or 800 e described above,among others described herein or otherwise within the scope of thepresent disclosure, may be implemented. For example, the system 900includes wireless devices 910 configured to transmit the location ofanimals 905 and/or other information to one or more of a string ofpositionally-fixed “fence-post” devices 920, which may in turncommunicate the same and/or additional information to a peripheral basestation 930, wherein each of the wireless devices 910 may besubstantially similar to one or more of the apparatus 700, 800 a, 800 b,800 c, 800 d, and/or 800 e described above, among others describedherein or otherwise within the scope of the present disclosure.

Referring to FIG. 9B, illustrated is a schematic view of at least aportion of an embodiment of the wireless device 910 shown in FIG. 9A.The wireless device 910 may be attached, clipped, pinned or otherwisesecured to the ear 905 a or another part of the animal 905 in such a waythat transmission of information pertaining to the location of theanimal 905 (and the wireless device 910) to another entity issubstantially indicative of such location. The scale of the wirelessdevice 910 is such that it would not cause significant discomfort orharm to the animal 905.

The wireless device 910 may include an energy supply 912 coupleddirectly (by physical contact) or indirectly between an antenna 911 andan IC chip 913 configured to perform or otherwise support the wirelesscommunication with the peripheral units 920 and/or 930 shown in FIG. 9A.The antenna 911, energy supply 912, and IC chip 913 may be substantiallysimilar to corresponding components described above with reference toFIGS. 7 and 8A-8E, among others.

Referring to FIG. 9C, illustrated is a schematic view of at least aportion of an embodiment of the peripheral unit 920 shown in FIG. 9A.The “fence-post” device 920 may be attached or otherwise bonded to afence post 922 or other stationary object between which positionalcomparisons for the determination of proximity can be made with thewireless device 910. The device 920 may also be configured for wirelessand/or wired communications with the peripheral base unit 930 shown inFIG. 9A.

The peripheral intermediary unit or fence-post device 920 may include anenergy supply 922 coupled directly (by physical contact) or indirectlybetween an antenna 921 and an IC chip 923 configured to perform orotherwise support the wireless communication with the wireless devices910, other peripheral intermediary units 920, and/or the peripheral baseunit 930 shown in FIG. 9A. The antenna 921, energy supply 922, and ICchip 923 may be substantially similar to corresponding componentsdescribed above with reference to FIGS. 7 and 8A-8E, among others.

Referring to FIG. 9D, illustrated is a schematic view of at least aportion of an embodiment of the peripheral base unit 930 shown in FIG.9A. The peripheral base unit 930 may be attached or otherwise bonded toa house 901 a, such as to its rooftop. The peripheral base unit 930 isconfigured to send and receive transmissions with the fence-post devices920 and/or the wireless devices 910.

The peripheral base unit 930 may include an energy supply 932 coupleddirectly (by physical contact) or indirectly between an antenna 931 andan IC chip 933 configured to perform or otherwise support the wirelesscommunication with the wireless devices 910 and/or the peripheralintermediary units 920 shown in FIG. 9A, and/or an additional peripheralbase unit 930. The antenna 931, energy supply 932, and IC chip 933 maybe substantially similar to corresponding components described abovewith reference to FIGS. 7 and 8A-8E, among others.

Referring to FIG. 9E, illustrated is a flow-chart diagram of at least aportion of an embodiment of the logic structure 950 of the IC chip 913within the wireless device 910 shown in FIGS. 9A and 9B. The structure950 includes a predetermined time interval 954, which may be about 5seconds in duration, upon the expiration of which the wireless device910 may be configured to determine whether it has received a signal fromone of the stationary fence-post devices 920 shown in FIGS. 9A and 9C.If it has not, as determined by decisional step 956, then the wirelessdevice 910 may transmit its location in a step 958 and subsequentlyreturn to the waiting interval 954.

If, however, the wireless device 910 has received a signal from afence-post device 920, then the wireless device 910 examines thereceived signal to determine whether the received signal is a “minor,”“larger,” or unrecognized signal. If the received signal is a mirrorsignal, as determined by a decisional step 960, then the wireless device910 delivers a “minor” signal to an actuator of the wireless device 910in a step 962, and steps 958 and 954 may then be subsequently performed.A “minor” signal may indicate that the animal 905 (and, hence, thewireless device 910) has moved to a location near or at a boundary of apredetermined area (e.g., a boundary of a grazing area). The “minor”signal may cause an actuator included in the wireless device 910 to emitan acoustic, electrical, vibration, aromatic or other signal which isreacted to by the animal 905, whether unconsciously, subconsciously orconsciously by moving away from the boundary. The actuator may beintegral to the IC chip 913 and, hence, integrally packaged with theenergy supply 912, while in other embodiments at least a portion of theactuator may be separate from, distinct from, or otherwise external tothe packaging material that substantially encloses the IC chip 913,energy supply 912, and antenna 911.

If the received signal is a “larger” signal, as determined by adecisional step 964, then the wireless device 910 delivers a “larger”signal to the actuator of the wireless device 910 in a step 966, andsteps 958 and 954 may then be subsequently performed. A “larger” signalmay indicate that the animal 905 (and, hence, the wireless device 910)has moved to or past the predetermined area boundary. The “larger”signal may cause the actuator included in the wireless device 910 toemit a more significant acoustic, electrical, vibration, aromatic orother signal, which may be more immediately reacted to by the animal 905relative to the reaction to the “minor” signal, whether such reaction isunconscious, subconscious or conscious. Consequently, the animal 905 maybe encouraged to more quickly move away from the boundary.

If the received signal is neither a “minor” signal nor a “larger”signal, as determined by decisional steps 956 and 964, collectively,then the wireless device 910 may be configured to transmit a malfunctionalert to one or more of the fence-post devices 920 and/or the peripheralbase unit 930 in a step 968. Steps 958 and 954 may then be repeated.

Referring to FIG. 9F, illustrated is a flow-chart diagram of at least aportion of an embodiment of logic structure 970 for the IC chip 923within the stationary fence-post device 920 shown in FIGS. 9A and 9C. Adefault state 972 may be configured to find a wireless device 910 bylistening for location transmissions from the wireless device 910. If notransmissions are received, as determined by a decisional step 974, thedefault state 972 may be resumed. However, once one of the wirelessdevices 910 comes into range of the fence-post device 920, as determinedby decisional step 974, the proximity of the two devices may becalculated by a step 976 such that at least one of various actions maybe performed based on the proximity.

For example, if the proximity is less than about one meter (or otherarbitrarily determined distance), as determined by a decisional step978, then a “minor” signal will be transmitted to the wireless device910 in a subsequent step 980. If the proximity is less than about 0.2meters (or other arbitrarily determined distance, less than the distanceexamined by decisional step 978), as determined by a decisional step982, then a “larger” signal may be transmitted to the wireless device910 in a subsequent step 984. If the proximity is determined to be lessthan 0 meters by a decisional step 986 and/or the decisional steps 978and 982, collectively, such as if the animal 905 has strayed beyond thefence-line defined by the proximity calculated in step 976, then apriority escape alert message may be generated by one or more of thefence post devices 920 in a subsequent step 988, which may includesuccessively transmitting the alert by the remaining fence post devices920 back to the base station 930. The priority escape message may, inturn, be interpreted by the base station 930 and be displayed on a basestation console 940 in communication with the base station 930,indicating to the operator that human intervention is required to herdthe animal 905 back within the intended boundary.

Referring to FIG. 9G, illustrated is at least a portion of an embodimentof logic structure 990 for an implementation regarding the case of whenan animal 905 comes into proximity of a fence-post device 920 andcrosses over the perimeter boundary. The wireless device 910 begins tocommunicate to the fence-post device 920 in a step 992 and, when ananimal 905 comes into a predetermined proximity of the fence-post device920, as determined by a decisional step 994, the calculation of theproximity of the animal 905 relative to the fence-post device 920 beginsin a step 996 (else listening continues in step 992). As the fence-postdevice 920 calculates the proximity of the animal 905 via the wirelessdevice 910, the fence-post device 920 begins to issue “minor” signals,followed by “large” signals, as described above, to further deter theanimal 905 as the animal gets the closer to the fence-post device 920.

Once the fence-post device 920 perimeter boundary is crossed by theanimal 905, which may indicate that the animal 905 has escaped or is indanger of escaping, as determined by a decisional step 997, the wirelessdevice 910 of that animal 905 continues to issue “larger” jolts inaccordance with the proximity calculations performed by the fence-postdevice 920. As the animal 905 (and its wireless device 910) exit therange of the fence-post device 920 on the outside of the perimeter,proximity measurements and “larger” and “minor” jolt signals and escapealert status notifications continue to be issued from the fence-postdevice 920, and may be similarly forwarded through adjacent fence-postdevices 920 back to the peripheral base station 930 and finally to theoperator's console 940. For example, the operator's console 940 mayindicate the animal escape status as well as the last-transmittedproximity data, which may be sent in a step 998, as a notification thatintervention is required in returning the animal 905 to within thedesignated safe zone.

Referring to FIG. 10, illustrated is a schematic view of at least aportion of an embodiment of a system 1000 according to aspects of thepresent disclosure. The system 1000 is one environment in which theapparatus 700, 800 a, 800 b, 800 c, 800 d and/or 800 e described abovemay be implemented. FIG. 10 illustrates the operation of one or morewireless devices 1010 which may each be configured to transmit heartwave-forms as part of an ECG. The wireless devices 1010 may each besubstantially similar to one or more of the apparatus 700, 800 a, 800 b,800 c, 800 d and/or 800 e described above, among others within the scopeof the present disclosure. For example, the wireless devices 1010 mayinclude an IC chip having at least a portion configured to sense orcommunicate with an associated sensing device to detect the heartwaver-forms and/or related electrical signals. The wireless devices 1010may also include an antenna, such that the detected signals and/orinformation related thereto may be transmitted to a peripheral base unit1020. The peripheral unit 1020 may be configured to receive the signalstransmitted from the wireless devices 1010, and possibly to performvarious processing of the signals and/or display the signals and/orrelated information on an analog and/or digital display 1025. Thewireless devices 1010 may be implantable, such that they may be usedrepeatedly. Consequently, the packaging material enclosing thecollocated components of the wireless devices 1010 may be surgicallysterile. However, the wireless devices 1010 may also be disposable,one-time-use products, possibly having adhesive on one surface thereofto adhere the devices 1010 to the test subject for the duration of theECG, such that the wireless devices 1010 may be subsequently removedwith ease, and subsequently discarded.

Referring to FIG. 11, illustrated is a schematic view of at least aportion of an embodiment of a system 1100 according to aspects of thepresent disclosure. The system 1100 is one environment in which theapparatus 700, 800 a, 800 b, 800 c, 800 d and/or 800 e described abovemay be implemented, among others within the scope of the presentdisclosure. FIG. 11 illustrates the operation of wireless devices 1110which may be configured to sense and/or transmit environmental data suchas temperature, pressure, wind speed and direction, and/or humidity,and/or mechanical data such as that relating to the operation of one ofvarious mechanical components within a modem aircraft. The devices 1110may also be configured for and utilized as wireless actuators forvarious mechanical components such as elements of the propulsion deviceor wing aerodynamics. The advantages of such wireless devices used insuch implementations may include the ability to decrease the quantity ofwiring within the structure of the aircraft. Outdated wiring can frayand lead to arcing or sparking of electrical energy from one wire toanother, which can in turn cause ignition of proximate flammablematerials or a chain reaction with potentially catastrophic results.Wireless, self-powered sensors and transmitters, however, may eliminatethe need for such wiring and can result in a significantly saferaircraft.

Referring to FIG. 12, illustrated is a schematic view of at least aportion of an embodiment of a system 1200 according to aspects of thepresent disclosure. The system 1200 is one environment in which theapparatus 700, 800 a, 800 b, 800 c, 800 d and/or 800 e described abovemay be implemented, among others within the scope of the presentdisclosure. FIG. 12, similar to that of FIG. 11, illustrates anautomotive embodiment in which wireless, self-powered sensors oractuators 1210 may be configured for and utilized as tire pressuresensors, speed detectors, road condition sensors, and/or actuators forone or more of various mechanical elements within a modern automotivemanufacture.

The foregoing has outlined features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions andalterations herein without departing from the spirit and scope of thepresent disclosure.

1. A method executed by a first electronic device, comprising: (a)receiving a first type of signal from a second electronic device,wherein at least one of the first and second electronic devices is awireless electronic device comprising at least one of an energy sourceand/or a multi-layer battery; (b) determining a characteristic of thesecond electronic device based on information received in the first typeof signal; and (c) transmitting a second type of signal to the secondelectronic device based on the determined characteristic; wherein thefirst and second electronic devices are each independently mobile.
 2. Amethod executed by a first electronic device, comprising: (a) receivinga first type of signal from a second electronic device, wherein at leastone of the first and second electronic devices is a wireless electronicdevice comprising at least one of an energy source and/or a multi-layerbattery; (b) determining a characteristic of the second electronicdevice based on information received in the first type of signal; and(c) transmitting a second type of signal to the second electronic devicebased on the determined characteristic; wherein the first and secondelectronic devices are each wireless electronic devices each comprisingat least one of an energy harvester, an energy generator, and/or amulti-layer battery.
 3. A method executed by a first electronic device,comprising: (a) receiving a first type of signal from a secondelectronic device, wherein at least one of the first and secondelectronic devices is a wireless electronic device comprising at leastone of an energy source and/or a multi-layer battery; (b) determining acharacteristic of the second electronic device based on informationreceived in the first type of signal; and (c) transmitting a second typeof signal to the second electronic device based on the determinedcharacteristic; wherein the first type of signal comprises informationbased on a presence of one of the first and second electronic devicesproximate the other of the first and second electronic devices.
 4. Amethod executed by a first electronic device, comprising: (a) receivinga first type of signal from a second electronic device, wherein at leastone of the first and second electronic devices is a wireless electronicdevice comprising at least one of an energy source and/or a multi-layerbattery; (b) determining a characteristic of the second electronicdevice based on information received in the first type of signal; and(c) transmitting a second type of signal to the second electronic devicebased on the determined characteristic; wherein the second type ofsignal acknowledges a presence of one of the first and second electronicdevices proximate the other of the first and second electronic devices.5. The method of claim 1 further comprising receiving a third type ofsignal that is configured to be utilized to determine a characteristicof the second electronic device's environment, wherein thecharacteristic of the second electronic device's environment comprisesat least one of: a location within the environment; an orientationwithin the environment; a composition of the environment; a temperatureof the environment; a pressure of the environment; a voltage of anelectrical feature associated with the environment; a current of anelectrical feature associated with the environment; a resistance of anelectrical feature associated with the environment; a concentration ofthe environment; a viscosity of the environment; and a biometriccharacteristic of a living animal proximate the second electronicdevice.
 6. A method executed by a first electronic device, comprising:(a) receiving a first type of signal from a second electronic device,wherein at least one of the first and second electronic devices is awireless electronic device comprising at least one of an energy sourceand/or a multi-layer battery; (b) determining a characteristic of thesecond electronic device based on information received in the first typeof signal; (c) transmitting a second type of signal to the secondelectronic device based on the determined characteristic; and (d)transmitting a third type of signal to a third electronic device basedon the determined characteristic.
 7. The method of claim 6 wherein thethird type of signal is configured to cause the third electronic deviceto automatically perform an action.
 8. The method of claim 6 wherein thethird type of signal is configured to cause the third electronic deviceto automatically display a predetermined message that is based on thedetermined characteristic.
 9. A method executed by a first electronicdevice, comprising the ordered steps of: (a) executing a waitinginterval of a predetermined time, and then determining whether the firstelectronic device has received a first signal from a second electronicdevice during the waiting interval, wherein at least one of the firstand second electronic devices is a wireless electronic device comprisingat least one of an energy source and/or a multi-layer battery; (b) ifthe first electronic device has not received a first type of signal froma second electronic device during the waiting interval, transmitting asecond type of signal from the first electronic device and thenreturning to step (a); (c) if the first electronic device has received afirst signal from a second electronic device during the waitinginterval, then delivering a third type of signal to an actuator of thefirst electronic device, wherein the third type of signal corresponds toinformation received in the first type of signal; and (d) operating theactuator based on information in the third type of signal.
 10. Themethod of claim 9 wherein step (b) comprises: if the first electronicdevice has not received a first type of signal from a second electronicdevice during the waiting interval, transmitting the second type ofsignal to a second electronic device and then returning to step (a). 11.The method of claim 10 wherein the second type of signal comprisesinformation based on a characteristic of the first electronic device'senvironment, wherein the characteristic of the first electronic device'senvironment comprises at least one of: a location within theenvironment; an orientation within the environment; a composition of theenvironment; a temperature of the environment; a pressure of theenvironment; a voltage of an electrical feature associated with theenvironment; a current of an electrical feature associated with theenvironment; a resistance of an electrical feature associated with theenvironment; a concentration of the environment; a viscosity of theenvironment; and a biometric characteristic of a living animal proximatethe second electronic device.
 12. The method of claim 9 furthercomprising transmitting a fourth type of signal if the first type ofsignal received by the first electronic device is not one of a pluralityof expected signals.
 13. The method of claim 9 further comprisingtransmitting a fourth type of signal to a third electronic device if thefirst type of signal received by the first electronic device is not oneof a plurality of expected signals.
 14. The method of claim 9 whereinone of the first and second electronic devices is mobile and the otherof the first and second electronic devices is not mobile.
 15. The methodof claim 9 wherein neither of the first and second electronic devices ismobile.
 16. The method of claim 9 wherein the first and secondelectronic devices are each independently mobile.
 17. The method ofclaim 9 wherein the first and second electronic devices are eachwireless electronic devices each comprising at least one of an energysource and/or a multi-layer battery.
 18. The method of claim 1 whereinthe first and second electronic devices are each wireless electronicdevices each comprising at least one of an energy source and/or amulti-layer battery.
 19. The method of claim 2 further comprisingreceiving a third type of signal that is configured to be utilized todetermine a characteristic of the second electronic device'senvironment, wherein the characteristic of the second electronicdevice's environment comprises at least one of: a location within theenvironment; an orientation within the environment; a composition of theenvironment; a temperature of the environment; a pressure of theenvironment; a voltage of an electrical feature associated with theenvironment; a current of an electrical feature associated with theenvironment; a resistance of an electrical feature associated with theenvironment; a concentration of the environment; a viscosity of theenvironment; and a biometric characteristic of a living animal proximatethe second electronic device.
 20. The method of claim 2 wherein thefirst and second electronic devices are each wireless electronic deviceseach comprising at least one of an energy source and/or a multi-layerbattery.
 21. The method of claim 3 further comprising receiving a thirdtype of signal that is configured to be utilized to determine acharacteristic of the second electronic device's environment, whereinthe characteristic of the second electronic device's environmentcomprises at least one of: a location within the environment; anorientation within the environment; a composition of the environment; atemperature of the environment; a pressure of the environment; a voltageof an electrical feature associated with the environment; a current ofan electrical feature associated with the environment; a resistance ofan electrical feature associated with the environment; a concentrationof the environment; a viscosity of the environment; and a biometriccharacteristic of a living animal proximate the second electronicdevice.
 22. The method of claim 3 wherein the first and secondelectronic devices are each wireless electronic devices each comprisingat least one of an energy source and/or a multi-layer battery.
 23. Themethod of claim 4 further comprising receiving a third type of signalthat is configured to be utilized to determine a characteristic of thesecond electronic device's environment, wherein the characteristic ofthe second electronic device's environment comprises at least one of: alocation within the environment; an orientation within the environment;a composition of the environment; a temperature of the environment; apressure of the environment; a voltage of an electrical featureassociated with the environment; a current of an electrical featureassociated with the environment; a resistance of an electrical featureassociated with the environment; a concentration of the environment; aviscosity of the environment; and a biometric characteristic of a livinganimal proximate the second electronic device.
 24. The method of claim 4wherein the first and second electronic devices are each wirelesselectronic devices each comprising at least one of an energy sourceand/or a multi-layer battery.